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SN74AUP1G57DBVT データシート(PDF) 1 Page - Texas Instruments |
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SN74AUP1G57DBVT データシート(HTML) 1 Page - Texas Instruments |
1 / 16 page www.ti.com FEATURES In2 3 2 4 6 1 In1 In2 Y GND In0 DBV PACKAGE (TOP VIEW) YEA, YEP, YZA, OR YZP PACKAGE (BOTTOM VIEW) DCK PACKAGE (TOP VIEW) 3 2 4 6 1 In1 In2 Y GND In0 3 2 4 6 1 In1 Y GND In0 In1 In0 In2 Y GND DRL PACKAGE (TOP VIEW) See mechanical drawings for dimensions. 1 4 2 3 6 VCC VCC VCC 5 VCC 5 5 5 DESCRIPTION/ORDERING INFORMATION SN74AUP1G57 LOW-POWER CONFIGURABLE MULTIPLE-FUNCTION GATE SCES503D – NOVEMBER 2003 – REVISED JUNE 2005 • Optimized for 3.3-V Operation • Available in the Texas Instruments • 3.6-V I/O Tolerant to Support Mixed-Mode NanoStar™ and NanoFree™ Packages Signal Operation • Low Static-Power Consumption (ICC = 0.9 µA • tpd = 5.3 ns Max at 3.3 V Max) • Suitable for Point-to-Point Applications • Low Dynamic-Power Consumption • Latch-Up Performance Exceeds 100 mA Per (Cpd = 4.3 pF Typ at 3.3 V) JESD 78, Class II • Low Input Capacitance (Ci = 1.5 pF Typ) • ESD Performance Tested Per JESD 22 • Low Noise – Overshoot and Undershoot <10% – 2000-V Human-Body Model of VCC (A114-B, Class II) • Ioff Supports Partial-Power-Down Mode – 200-V Machine Model (A115-A) Operation – 1000-V Charged-Device Model (C101) • Includes Schmitt-Trigger Inputs • ESD Protection Exceeds ±5000 V With • Wide Operating VCC Range of 0.8 V to 3.6 V Human-Body Model The AUP family is TI's premier solution to the industry's low-power needs in battery-powered portable applications. This family ensures a very low static and dynamic power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in an increased battery life. This product also maintains excellent signal integrity, which produces very low undershoot and overshoot characteristics. ORDERING INFORMATION TA PACKAGE(1) ORDERABLE PART NUMBER TOP-SIDE MARKING(2) NanoStar™ – WCSP (DSBGA) Tape and reel SN74AUP1G57YEPR 0.23-mm Large Bump – YEP _ _ _HH_ NanoFree™ – WCSP (DSBGA) Tape and reel SN74AUP1G57YZPR 0.23-mm Large Bump – YZP (Pb-free) –40°C to 85°C SOT (SOT-23) – DBV Tape and reel SN74AUP1G57DBVR HA7_ SOT (SC-70) – DCK Tape and reel SN74AUP1G57DCKR HH_ SOT (SOT-553) – DRL Reel of 4000 SN74AUP1G57DRLR HH_ (1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. (2) DBV/DCK/DRL: The actual top-side marking has one additional character that designates the assembly/test site. YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoStar, NanoFree are trademarks of Texas Instruments. PRODUCTION DATA information is current as of publication date. Copyright © 2003–2005, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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