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MC7445ARX1000LG データシート(PDF) 56 Page - Freescale Semiconductor, Inc

部品番号 MC7445ARX1000LG
部品情報  RISC Microprocessor Hardware Specifications
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メーカー  FREESCALE [Freescale Semiconductor, Inc]
ホームページ  http://www.freescale.com
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MC7445ARX1000LG データシート(HTML) 56 Page - Freescale Semiconductor, Inc

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MPC7455 RISC Microprocessor Hardware Specifications, Rev. 4.1
56
Freescale Semiconductor
System Design Information
interface thermal resistance. That is, the bare joint results in a thermal resistance approximately seven times greater
than the thermal grease joint.
Often, heat sinks are attached to the package by means of a spring clip to holes in the printed-circuit board (see
Figure 27). Therefore, the synthetic grease offers the best thermal performance, considering the low interface
pressure and is recommended due to the high power dissipation of the MPC7455. Of course, the selection of any
thermal interface material depends on many factors—thermal performance requirements, manufacturability, service
temperature, dielectric properties, cost, etc.
Figure 29. Thermal Performance of Select Thermal Interface Material
The board designer can choose between several types of thermal interface. Heat sink adhesive materials should be
selected based on high conductivity, yet adequate mechanical strength to meet equipment shock/vibration
requirements. There are several commercially available thermal interfaces and adhesive materials provided by the
following vendors:
The Bergquist Company
800-347-4572
18930 West 78th St.
Chanhassen, MN 55317
Internet: www.bergquistcompany.com
Chomerics, Inc.
781-935-4850
77 Dragon Ct.
Woburn, MA 01888-4014
Internet: www.chomerics.com
0
0.5
1
1.5
2
0
1020
30
40
50607080
Silicone Sheet (0.006 in.)
Bare Joint
Floroether Oil Sheet (0.007 in.)
Graphite/Oil Sheet (0.005 in.)
Synthetic Grease
Contact Pressure (psi)


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