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ILC7010AIC531X データシート(PDF) 9 Page - Fairchild Semiconductor |
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ILC7010AIC531X データシート(HTML) 9 Page - Fairchild Semiconductor |
9 / 11 page PRODUCT SPECIFICATION ILC7010/7011 REV. 1.0.5 3/21/02 9 General PCB Layout Considerations To achieve the full performance of the device, careful circuit layout and grounding technique must be observed. Establish- ing a small local ground, to which the GND pin, the output and bypass capacitors are connected, is recommended, while the input capacitor should be grounded to the main ground plane. The quiet local ground is then routed back to the main ground plane using feedthrough vias. In general, the high frequency compensation components (input, bypass, and output capacitors)should be located as close to the device as possible. The proximity of the output capacitor is especially important to achieve optimal noise compensation from the onboard error amplifier, especially during high load conditions. A large copper area in the local ground will provide the heat sinking discussed above when high power dissipation signif- icantly increases the temperature of the device. Component-side copper provides significantly better thermal performance for this surface-mount device, compared to that obtained when using only copper planes on the underside. |
同様の部品番号 - ILC7010AIC531X |
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同様の説明 - ILC7010AIC531X |
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