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MC-7831-AZ データシート(PDF) 2 Page - California Eastern Labs

部品番号 MC-7831-AZ
部品情報  NECs 870 MHz GaAs CATV PUSH-PULL AMPLIFIER
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メーカー  CEL [California Eastern Labs]
ホームページ  http://www.cel.com
Logo CEL - California Eastern Labs

MC-7831-AZ データシート(HTML) 2 Page - California Eastern Labs

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MC-7831, 7832, 7833
Life Support Applications
These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably
be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and
agree to fully indemnify CEL for all damages resulting from such improper use or sale.
ABSOLUTE
MAXIMUM RATINGS1 (TCASE= 30 °C)
SYMBOLS
PARAMETERS
UNITS
RATINGS
VDD
Supply Voltage
V
30
VI
Input Voltage2
dBmV
65
TC
Operating Case Temperature
°C
-30 to +100
TSTG
Storage Temperature
°C
-40 to +100
Note:
1. Operation in excess of any one of these parameters may result in
permanent damage.
2. Maximum single channel power applied to the input for 1 minute
with no measurable degradation in performance.
SYMBOLS
PARAMETERS
UNITS MIN TYP MAX
VDD
Supply Voltage, MC-7831
V
23.5 24.0 24.5
MC-7832
23.5 24.0 24.5
MC-7833
23.5 24.0 24.5
Vi
Input Voltage1,
MC-7831 dBmV
21.0 27.5
MC-7832
21.0 27.5
MC-7833
19.0 25.5
TC
Operating Case, MC-7831
°C
-30 +25 +85
Temperature
MC-7832
-30 +25 +85
MC-7833
-30 +25 +85
RECOMMENDED
OPERATING CONDITIONS (Zs = ZL = 75Ω)
Note:
1. Test Conditions: 110 Channels, Flat
PART NUMBER
PACKAGE
QUANTITY
MC-7831-AZ
7-pin special with heatsink
50pcs max/ Tray
MC-7832-AZ
7-pin special with heatsink
50pcs max/ Tray
MC-7833-AZ
7-pin special with heatsink
50pcs max/ Tray
ORDERING INFORMATION
1. The space between PC board and root of the lead should be
kept more than 1 mm to prevent undesired stress on the lead and
also should be kept less than 4 mm to prevent undesired parasitic
inductance.
Recommended space is 2.0 to 3.0 mm typical.
2. Recommended torque strength of the screw is 59 to 78 Ncm.
3. Form the ground pattern as wide as possible to minimize ground
impedance. (to prevent undesired oscillation)
All the ground pins must be connected together with wide ground
pattern to decrease impedance difference.
NOTES ON CORRECT USE
This product should be soldered in the following recommended
conditions. Other soldering methods and conditions than the
recommended conditions are to be consulted with our sales
representatives.
RECOMMENDED SOLDERING CONDITIONS
Soldering
Soldering
Condition
Method
Conditions
Symbol
Pin Part Heating
Pin area temperature: less
than 260°C1
Hour: Within 2 sec./pin
Note.
1. The point of pin part heating must be kept at a distance of more
than 1.2 mm from the root of lead.
A Business Partner of NEC Compound Semiconductor Devices, Ltd.
07/08/2003


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