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FAN2535 データシート(PDF) 7 Page - Fairchild Semiconductor |
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FAN2535 データシート(HTML) 7 Page - Fairchild Semiconductor |
7 / 11 page REV. 1.0.2 8/26/03 7 PRODUCT SPECIFICATION FAN2534/FAN2535 General PWB Layout Considerations For optimum device performance, careful circuit layout and grounding technics must be used. Establishing a small local ground, to which the GND pin, and the output and bypass capacitors are connected, is recommended, while the input capacitor should be grounded to the main ground plane. The quiet local ground is then routed back to the main ground plane using feedthrough vias. In general, the high- frequency compensation components (input, bypass, and output capacitors) should be located as close to the device as possible. The proximity of the output capacitor is especially important to achieve optimum performance, especially during high load conditions. A large copper area in the local ground serves as heat sink (as discussed above) when high power dissipation significantly increases device temperature. Component-side copper provides significantly better thermal performance. Added feedthrough connecting the device side ground plane to the back plane further reduces thermal resistance. |
同様の部品番号 - FAN2535 |
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同様の説明 - FAN2535 |
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