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FAN6520AIM データシート(PDF) 10 Page - Fairchild Semiconductor

部品番号 FAN6520AIM
部品情報  Single Synchronous Buck PWM Controller
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メーカー  FAIRCHILD [Fairchild Semiconductor]
ホームページ  http://www.fairchildsemi.com
Logo FAIRCHILD - Fairchild Semiconductor

FAN6520AIM データシート(HTML) 10 Page - Fairchild Semiconductor

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10
REV. 1.0.2 8/26/04
FAN6520A
PRODUCT SPECIFICATION
RMS current required by the circuit. The capacitor voltage
rating should be at least 1.25 times greater than the maxi-
mum input voltage and a voltage rating of 1.5 times is a
conservative guideline.
The RMS current rating requirement (IRMS) for the input
capacitor of a buck regulator is:
where the converter duty cycle;
. For a
through-hole design, several electrolytic capacitors may be
needed. For surface-mount designs, solid tantalum capaci-
tors can be used, but caution must be exercised with regard
to the capacitor’s surge current rating. The capacitors must
be capable of handling the surge current at power-up. Some
capacitor series available from reputable manufacturers are
surge current tested.
Bootstrap Circuit
The bootstrap circuit uses a charge storage capacitor
(CBOOT) and the internal diode, as shown in Figure 1.
Selection of these components should be done after the
high-side MOSFET has been chosen. The required
capacitance is determined using the following equation:
where QG is the total gate charge of the high-side MOSFET,
and
∆VBOOT is the voltage droop allowed on the high-side
MOSFET drive. To prevent loss of gate drive, the bootstrap
capacitance should be at least 50 times greater than the CISS
of Q1.
Thermal Considerations
Total device dissipation:
PD = PQ + PHDRV + PLDRV
(4)
where PQ represents quiescent power dissipation:
PQ = VCC × [4mA + 0.036 (FSW – 100)]
(5)
where FSW is switching frequency (in kHz).
PHDRV represents internal power dissipation of the upper
FET driver.
PHDRV = PH(R) × PH(F)
(6)
Where PH(R) and PH(F) are internal dissipations for the
rising and falling edges respectively:
where:
PQ1 = QG1 × VGS(Q1) × FSW
(9)
Where QG1 is total gate charge of Q1 for its applied VGS.
As described in the equations above, the total power con-
sumed in driving the gate is divided in proportion to the
resistances in series with the MOSFET's internal gate node
as shown in Figure 9.
Figure 9. Driver Dissipation Model
RG is the polysilicon gate resistance, internal to the FET.
RE is the external gate drive resistor implemented in many
designs. Note that the introduction of RE can reduce driver
power dissipation, but excess RE may cause errors in the
“adaptive gate drive” circuitry. For more information
please refer to Fairchild app note AN-6003, “Shoot-through”
in Synchronous Buck Converters.
(http://www.fairchildsemi.com/an/AN/AN-6003.pdf)
PLDRV is dissipation of the lower FET driver.
PLDRV = PL(R) × PL(F)
(10)
Where PH(R) and PH(F) are internal dissipations for the rising
and falling edges, respectively:
where:
PQ2 = QG2 × VGS(Q2) × FSW
(13)
I
RMS
I
L
DD
2
()
=
(2)
D
V
OUT
V
IN
--------------
=
C
BOOT
Q
G
∆V
BOOT
----------------------
=
(3)
P
HR
()
P
Q1
R
HUP
R
HUP
R
E
R
G
++
-------------------------------------------
×
=
(7)
P
HF
()
P
Q1
R
HDN
R
HDN
R
E
R
G
++
--------------------------------------------
×
=
(8)
HDRV
Q1
G
R
G
RE
RHUP
BOOT
SW
R
HDN
S
P
LR
()
P
Q2
R
LUP
R
LUP
R
E
R
G
++
-------------------------------------------
×
=
(11)
P
LF
()
P
Q2
R
LDN
R
HDN
R
E
R
G
++
--------------------------------------------
×
=
(12)


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