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LM25183-Q1 データシート(PDF) 4 Page - Texas Instruments

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部品番号. LM25183-Q1
部品情報  LM25183-Q1 42-VIN PSR Flyback DC/DC Converter with 65-V, 2.5-A Integrated MOSFET
ダウンロード  40 Pages
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メーカー  TI1 [Texas Instruments]
ホームページ  http://www.ti.com
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LM25183-Q1 Datasheet(HTML) 4 Page - Texas Instruments

 
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LM25183-Q1
SNVSBJ4 – APRIL 2020
www.ti.com
Product Folder Links: LM25183-Q1
Submit Documentation Feedback
Copyright © 2020, Texas Instruments Incorporated
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6 Specifications
6.1 Absolute Maximum Ratings
Over the recommended operating junction temperature range of –40°C to 150°C (unless otherwise noted)
(1)
MIN
MAX
UNIT
Input voltage
VIN to GND
–0.3
45
V
EN/UVLO to GND
–0.3
45
TC to GND
–0.3
6
SS/BIAS to GND
–0.3
14
FB to GND
–0.3
45.3
FB to VIN
–0.3
0.3
RSET to GND
–0.3
3
Output voltage
SW to GND
–1.5
70
V
SW to GND (20-ns transient)
–3
Operating junction temperature, TJ
–40
150
°C
Storage temperature, Tstg
–55
150
°C
(1)
AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
6.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human body model (HBM), per AEC Q100-002
HBM ESD Classification Level 2 (1)
±2000
V
Charged device model (CDM), per
AEC Q100-011
CDM ESD Classification Level C4B
All pins except 1,
4, 5, and 8
±500
Pins 1, 4, 5, and 8
±750
6.3 Recommended Operating Conditions
Over the recommended operating junction temperature range of –40°C to 150°C (unless otherwise noted)
MIN
NOM
MAX
UNIT
VIN
Input voltage
4.5
42
V
VSW
SW voltage
65
V
VEN/UVLO
EN/UVLO voltage
42
V
VSS/BIAS
SS/BIAS voltage
13
V
TJ
Operating junction temperature
–40
150
°C
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.4 Thermal Information
THERMAL METRIC(1)
LM25183-Q1
UNIT
NGU (WSON)
8 PINS
RΘJA
Junction-to-ambient thermal resistance
41.3
°C/W
RΘJC(top)
Junction-to-case (top) thermal resistance
34.7
°C/W
RΘJB
Junction-to-board thermal resistance
19.1
°C/W
ΨJT
Junction-to-top characterization parameter
0.3
°C/W
ΨJB
Junction-to-board characterization parameter
19.2
°C/W
RΘJC(bot)
Junction-to-case (bottom) thermal resistance
3.2
°C/W


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