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LP5910 データシート(PDF) 16 Page - Texas Instruments

部品番号. LP5910
部品情報  LP5910 300-mA Low-Noise, Low-IQ LDO
ダウンロード  35 Pages
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メーカー  TI1 [Texas Instruments]
ホームページ  http://www.ti.com
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LP5910 Datasheet(HTML) 16 Page - Texas Instruments

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LP5910
SNVSA91E – SEPTEMBER 2015 – REVISED JULY 2017
www.ti.com
Product Folder Links: LP5910
Submit Documentation Feedback
Copyright © 2015–2017, Texas Instruments Incorporated
The maximum allowable junction temperature (TJ(MAX)) determines maximum power dissipation allowed (PD(MAX))
for the device package.
Power dissipation and junction temperature are most often related by the junction-to-ambient thermal resistance
(RθJA) of the combined PCB and device package and the temperature of the ambient air (TA), according to
Equation 2 or Equation 3:
TJ(MAX) = TA(MAX) + (RθJA × PD(MAX))
(2)
PD(MAX) = (TJ(MAX) - TA(MAX)) / RθJA
(3)
Unfortunately, this RθJA is highly dependent on the heat-spreading capability of the particular PCB design, and
therefore varies according to the total copper area, copper weight, and location of the planes. The RθJA recorded
in Thermal Information is determined by the specific EIA/JEDEC JESD51-7 standard for PCB and copper-
spreading area, and is to be used only as a relative measure of package thermal performance. For a well-
designed thermal layout, RθJA is actually the sum of the package junction-to-case (bottom) thermal resistance
(RθJCbot) plus the thermal resistance contribution by the PCB copper area acting as a heat sink.
8.2.2.10 Estimating Junction Temperature
The EIA/JEDEC standard recommends the use of psi (Ψ) thermal characteristics to estimate the junction
temperatures of surface mount devices on a typical PCB board application. These characteristics are not true
thermal resistance values, but rather package specific thermal characteristics that offer practical and relative
means of estimating junction temperatures. These psi metrics are determined to be significantly independent of
copper-spreading area. The key thermal characteristics (ΨJT and ΨJB) are given in Thermal Information and are
used in accordance with Equation 4 or Equation 5.
TJ(MAX) = TTOP + (ΨJT × PD(MAX))
where
PD(MAX) is explained in Equation 1.
TTOP is the temperature measured at the center-top of the device package.
(4)
TJ(MAX) = TBOARD + (ΨJB × PD(MAX))
where
PD(MAX) is explained in Equation 1.
TBOARD is the PCB surface temperature measured 1-mm from the device package and centered on the
package edge.
(5)
For more information about the thermal characteristics ΨJT and ΨJB, see the TI Application Report:
Semiconductor and IC Package Thermal Metrics (SPRA953), available for download at www.ti.com.
For more information about measuring TTOP and TBOARD, see the TI Application Report: Using New Thermal
Metrics (SBVA025), available for download at www.ti.com.
For more information about the EIA/JEDEC JESD51 PCB used for validating RθJA, see the TI Application Report:
Thermal Characteristics of Linear and Logic Packages Using JEDEC PCB Designs (SZZA017), available for
download at www.ti.com.


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