Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com

103171D • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice. • June 21, 2005

3

CX805-30 BASEBAND PROCESSOR PRODUCT SUMMARY

Figure 2. 160-pin FPBGA Package Dimensions

NOTES:

1. All dimensions are in millimeters.

2. For die orientation, see appropriate bonding diagram.

3. FPBGA lands are solder mask defined.

4. Minimum solder ball pitch is 0.80 mm.

5. Dimensioning and tolerancing in accordance with ASME Y14.5M-1994

12 x 12 FPBGA - 160 Balls/ 0.80 mm Ball Pitch

12.00 ± 0.10

Seating Plane

Mold

1.5 MAX

0.3 ± 0.05

0.45 ± 0.05 TYP

C

0.8

0.4

0.4

0.8

J

1

F

A

G

E

D

H

B

K

L

M

N

P

2

3

4

5

6

7

14

13

12

11

10

9

8

A1 Ball Pad Corner

Pin 1 Indicator