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IMX8MNIEC データシート(PDF) 1 Page - NXP Semiconductors |
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IMX8MNIEC データシート(HTML) 1 Page - NXP Semiconductors |
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1 / 89 page  NXP Semiconductors Data Sheet: Technical Data Document Number: IMX8MNIEC Rev. 0.1, 03/2020 Ordering Information See Table 2 on page 6 NXP reserves the right to change the production detail specifications as may be required to permit improvements in the design of its products. MIMX8MN6CVTIZAA MIMX8MN5CVTIZAA MIMX8MN4CVTIZAA MIMX8MN3CVTIZAA MIMX8MN2CVTIZAA MIMX8MN1CVTIZAA Package Information Plastic Package FCBGA 14 x 14 mm, 0.5 mm pitch 1 i.MX 8M Nano introduction The i.MX 8M Nano application processor represents NXP’s latest graphics and audio experience combining state-of-the-art media-specific features with high-performance processing while optimized for lowest power consumption. The i.MX 8M Nano family of processors features advanced implementation of a quad Arm® Cor- tex®-A53 core, which operates at speeds of up to 1.4 GHz. A general purpose Cortex®-M7 running up to 600 MHz core processor is for real-time and low-power processing. The i.MX 8M Nano family of processors provides addi- tional computing resources and peripherals: • Advanced security modules for secure boot, cipher acceleration and DRM support • A wide range of audio interfaces, including I2S, AC 97, TDM, and S/PDIF • Large set of peripherals that are commonly used in consumer/industrial market, including USB and Ethernet i.MX 8M Nano Applications Processor Datasheet for Industrial Products 1. i.MX 8M Nano introduction . . . . . . . . . . . . . . . . . . . . . . . 1 1.1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 1.2. Ordering information . . . . . . . . . . . . . . . . . . . . . . . 6 2. Modules list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.1. Recommended connections for unused input/output 12 3. Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . 14 3.1. Chip-level conditions . . . . . . . . . . . . . . . . . . . . . . 14 3.2. Power supplies requirements and restrictions . . . 22 3.3. PLL electrical characteristics . . . . . . . . . . . . . . . . 26 3.4. On-chip oscillators . . . . . . . . . . . . . . . . . . . . . . . . 28 3.6. I/O AC parameters . . . . . . . . . . . . . . . . . . . . . . . 29 3.7. Output buffer impedance parameters . . . . . . . . . 31 3.8. System modules timing . . . . . . . . . . . . . . . . . . . . 33 3.9. External peripheral interface parameters . . . . . . 34 4. Boot mode configuration . . . . . . . . . . . . . . . . . . . . . . . . 68 4.1. Boot mode configuration pins . . . . . . . . . . . . . . . 68 4.2. Boot device interface allocation . . . . . . . . . . . . . . 68 5. Package information and contact assignments . . . . . . . 70 5.1. 14 x 14 mm package information . . . . . . . . . . . . 70 5.2. DDR pin function list . . . . . . . . . . . . . . . . . . . . . . 85 6. Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88 |
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