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SN74HCS164 データシート(PDF) 4 Page - Texas Instruments

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部品番号. SN74HCS164
部品情報  SN74HCS164 8-Bit Parallel-Out Serial Shift Registers With Schmitt-Trigger Inputs
ダウンロード  24 Pages
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メーカー  TI [Texas Instruments]
ホームページ  http://www.ti.com
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SN74HCS164 Datasheet(HTML) 4 Page - Texas Instruments

 
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
MAX
UNIT
VCC
Supply voltage
–0.5
7
V
IIK
Input clamp current(2)
VI < –0.5 V or VI > VCC + 0.5 V
±20
mA
IOK
Output clamp current(2)
VI < –0.5 V or VI > VCC + 0.5 V
±20
mA
IO
Continuous output current
VO = 0 to VCC
±35
mA
Continuous current through VCC or GND
±70
mA
TJ
Junction temperature(3)
150
°C
Tstg
Storage temperature
–65
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
(2)
The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
(3)
Guaranteed by design.
6.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/
JEDEC JS-001(1)
±4000
V
Charged-device model (CDM), per JEDEC
specification JESD22-C101(2)
±1500
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
VCC
Supply voltage
2
5
6
V
VI
Input voltage
0
VCC
V
VO
Output voltage
0
VCC
V
TA
Ambient temperature
–40
125
°C
6.4 Thermal Information
THERMAL METRIC(1)
SN74HCS164
UNIT
PW (TSSOP)
D (SOIC)
16 PINS
16 PINS
RθJA
Junction-to-ambient thermal resistance
141.2
122.2
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
78.8
80.9
°C/W
RθJB
Junction-to-board thermal resistance
85.8
80.6
°C/W
ΨJT
Junction-to-top characterization parameter
27.7
40.4
°C/W
ΨJB
Junction-to-board characterization parameter
85.5
80.3
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
N/A
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
SN74HCS164
SCLS827 – AUGUST 2020
www.ti.com
4
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Product Folder Links: SN74HCS164


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