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SN74HCS244-Q1 データシート(PDF) 4 Page - Texas Instruments

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部品番号. SN74HCS244-Q1
部品情報  SN74HCS244-Q1 Automotive Octal Buffers and Line Drivers With Schmitt-Trigger Inputs and 3-State Outputs
ダウンロード  18 Pages
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メーカー  TI [Texas Instruments]
ホームページ  http://www.ti.com
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SN74HCS244-Q1 Datasheet(HTML) 4 Page - Texas Instruments

 
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
MAX
UNIT
VCC
Supply voltage
–0.5
7
V
IIK
Input clamp current(2)
VI < 0 or VI > VCC
±20
mA
IOK
Output clamp current(2)
VO < 0 or VO > VCC
±20
mA
IO
Continuous output current
VO = 0 to VCC
±35
mA
ICC
Continuous current through VCC or GND
±70
mA
TJ
Junction temperature
150
°C
Tstg
Storage temperature
–65
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
(2)
The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
6.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human body model (HBM), per AEC Q100-002(1)
HBM ESD Classification Level 2
±4000
V
Charged device model (CDM), per AEC
Q100-011
CDM ESD Classification Level C4B
±1000
(1)
AEC Q100-002 indicate that HBM stressing shall be in accordrance with the ANSI/ESDA/JEDEC JS-001 specification.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
VCC
Supply voltage
2
5
6
V
VI
Input voltage
0
VCC
V
VO
Output voltage
0
VCC
V
TA
Ambient temperature
–55
125
°C
6.4 Thermal Information
THERMAL METRIC(1)
SN74HCS244-Q1
UNIT
PW (TSSOP)
14 PINS
RθJA
Junction-to-ambient thermal resistance
151.7
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
79.4
°C/W
RθJB
Junction-to-board thermal resistance
94.7
°C/W
ΨJT
Junction-to-top characterization parameter
25.2
°C/W
ΨJB
Junction-to-board characterization parameter
94.1
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
SN74HCS244-Q1
SCLS821 – JULY 2020
www.ti.com
4
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