6.4 Thermal Information, LM393LV

THERMAL METRIC (1)

LM393LV

UNIT

D (SOIC)

PW

(TSSOP)

DGK

(VSSOP)

DSG

(WSON)

DDF

(SOT-23)

8 PINS

8 PINS

8 PINS

8 PINS

8 PINS

Junction-to-ambient thermal resistance

167.7

221.7

–

175.2

–

°C/W

Junction-to-case (top) thermal resistance

107.0

109.1

–

178.1

–

°C/W

Junction-to-board thermal resistance

111.2

152.5

–

139.5

–

°C/W

Junction-to-top characterization parameter

53.1

36.4

–

47.2

–

°C/W

Junction-to-board characterization parameter

110.4

150.7

–

138.9

–

°C/W

Junction-to-case (bottom) thermal resistance

–

–

–

127.3

–

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.5 Thermal Information, LM339LV

THERMAL METRIC(1)

LM339LV

UNIT

D (SOIC)

PW

(TSSOP)

RTE

(WQFN)

DYY

(SOT-23)

14 PINS

14 PINS

16 PINS

14 PINS

Junction-to-ambient thermal resistance

136.0

155.0

134.1

–

°C/W

Junction-to-case (top) thermal resistance

91.2

82.0

122.6

–

°C/W

Junction-to-board thermal resistance

92.0

98.5

109.3

–

°C/W

Junction-to-top characterization parameter

46.9

25.7

30.9

–

°C/W

Junction-to-board characterization parameter

91.6

97.6

108.3

–

°C/W

Junction-to-case (bottom) thermal resistance

–

–

98.7

–

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

LM393LV, LM339LV

SNOSDA4B – JUNE 2020 – REVISED DECEMBER 2020

www.ti.com

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