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BD9G500EFJ-LA データシート(PDF) 30 Page - Rohm |
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BD9G500EFJ-LA データシート(HTML) 30 Page - Rohm |
30 / 39 page 30/36 TSZ02201-0F2F0AJ00280-1-2 © 2020 ROHM Co., Ltd. All rights reserved. 11.Jun.2020 Rev.001 www.rohm.com TSZ22111 • 15 • 001 BD9G500EFJ-LA PCB Layout Design - continued Accordingly, design the PCB layout with particular attention paid to the following points. ·Provide the input capacitor close to the VIN pin of the IC as possible on the same plane as the IC. ·If there is any unused area on the PCB, provide a copper foil plane for the ground node to assist heat dissipation from the IC and the surrounding components. ·Switching nodes such as SW are susceptible to noise due to AC coupling with other nodes. Trace to the coil and catch diode as thick and short as possible. ·Provide lines connected to the FB pin and the COMP pin as far from the SW node. ·Provide the output capacitor away from the input capacitor in order to avoid the effect of harmonic noise from the input. Top Layer Bottom Layer Figure 62. Example of Sample Board Layout Pattern |
同様の部品番号 - BD9G500EFJ-LA |
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同様の説明 - BD9G500EFJ-LA |
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