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BM63374S-VA データシート(PDF) 11 Page - Rohm

部品番号 BM63374S-VA
部品情報  600V IGBT Intelligent Power Module (IPM)
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メーカー  ROHM [Rohm]
ホームページ  http://www.rohm.com
Logo ROHM - Rohm

BM63374S-VA データシート(HTML) 11 Page - Rohm

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BM63374S-VA
BM63374S-VC
TSQ50501-BM63374S-2
© 2020 ROHM Co., Ltd. All rights reserved.
30.Jul.2020 Rev.001
www.rohm.com
TSZ22111・15・001
4) Thermal Shutdown (TSD), monitoring LVIC temperature
d1. Normal operation: IGBT ON and outputs current IC.
d2. LVIC temperature (Tj) exceeds thermal shutdown trip level (TSDT).
d3. All low side IGBTs turn off in spite of control input condition.
d4. FO outputs for tFO=180µs (Min),
but output is extended while Tj is above thermal shutdown release level (TSDT-TSDHYS).
d5. Tj drops to TSDT-TSDHYS
d6. Even if Tj reaches TSDT-TSDHYS during LIN=H, IGBT
s don’t turn on until inputting the next ON signal (LIN=L→H).
IGBT of each phase can return to normal state by inputting ON signal to each phase.
d7. Normal operation: IGBT ON and outputs current IC.
Notice
1) In case of TSD trip and FO output, please stop controlling IPM quickly to avoid the abnormal state.
2) If the cooling system is in abnormal state (e.g. heat sink comes off, fixed loosely, or cooling fan stops) when TSD trips,
don
’t reuse IPM. This may cause the junction temperature of power chips to exceed its maximum rating of Tjmax
(150°C).
3) TSD function detects LVIC temperature, so it cannot respond to rapid temperature rise of power chip. Therefore, TSD
will not work properly in the case of rapid temperature rise like motor lock or over current.
LIN
RESET
d1
TSD
Ic
FO
SET
TSDT
TSDT-TSDHYS
Tj (LVIC)
d2
d5
d3
d4
d6
d7
Figure 14. TSD Timing Chart


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