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MC74VHC1G01DTT3 データシート(PDF) 2 Page - E-Tech Electronics LTD

部品番号 MC74VHC1G01DTT3
部品情報  2-Input NAND Gate with Open Drain Output
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メーカー  ETL [E-Tech Electronics LTD]
ホームページ  http://e-tech.com.hk
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MC74VHC1G01DTT3 データシート(HTML) 2 Page - E-Tech Electronics LTD

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VH1–2/4
MC74VHC1G00
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
V CC
DC Supply Voltage
– 0.5 to + 7.0
V
V IN
DC Input Voltage
– 0.5 to 7.0
V
V OUT
DC Output Voltage
– 0.5 to 7.0
V
I IK
DC Input Diode Current
–20
mA
I OK
DC Output Diode Current
V
OUT < GND; V OUT > V CC
+20
mA
I OUT
DC Output Sink Current
+ 25
mA
I CC
DC Supply Current per Supply Pin
+50
mA
P D
Power dissipation in still air
SC–88A, TSOP–5
200
mW
θ
JA
Thermal resistance
SC–88A, TSOP–5
333
°C/W
T L
Lead Temperature, 1 mm from Case for 10 Seconds
260
°C
T J
Junction Temperature Under Bias
+ 150
°C
T
stg
Storage temperature
–65 to +150
°C
V ESD
ESD Withstand Voltage
Human Body Model (Note 2)
>2000
V
Machine Model (Note 3)
> 200
Charged Device Model (Note 4)
N/A
I LATCH–UP
Latch–Up Performance
Above V CC and Below GND at 125°C (Note 5)
± 500
mA
1. Maximum Ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions
beyond those indicated may adversely affect device reliability. Functional operation under absolute–maximum–rated conditions is
not implied. Functional operation should be restricted to the Recommended Operating Conditions.
2. Tested to EIA/JESD22–A114–A
3. Tested to EIA/JESD22–A115–A
4. Tested to JESD22–C101–A
5. Tested to EIA/JESD78
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
V CC
DC Supply Voltage
2.0
5.5
V
V IN
DC Input Voltage
0.0
5.5
V
V OUT
DC Output Voltage
0.0
7.0
V
T A
Operating Temperature Range
– 55
+ 125
°C
t r ,t f
Input Rise and Fall Time
V
CC = 3.3 ± 0.3 V
0
100
ns/V
V
CC = 5.0 ± 0.5 V
0
20
DEVICE JUNCTION TEMPERATURE VERSUS
TIME TO 0.1% BOND FAILURES
Junction
Time,
Time,
Temperature °C
Hours
Years
80
1,032,200
117.8
90
419,300
47.9
100
178,700
20.4
110
79,600
9.4
120
37,000
4.2
130
17,800
2.0
140
8,900
1.0
Figure 3. Failure Rate vs. Time
Junction Temperature
1
1
10
100
1000
TIME, YEARS


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