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HCPL-5530 データシート(PDF) 6 Page - Agilent(Hewlett-Packard)

部品番号 HCPL-5530
部品情報  Hermetically Sealed, Transistor Output Optocouplers for Analog and Digital Applications
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メーカー  HP [Agilent(Hewlett-Packard)]
ホームページ  http://www.home.agilent.com
Logo HP - Agilent(Hewlett-Packard)

HCPL-5530 データシート(HTML) 6 Page - Agilent(Hewlett-Packard)

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6
Option
Description
100
Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This option is
available on commercial and hi-rel product in 8 and 16 pin DIP (see drawings below for details).
200
Lead finish is solder dipped rather than gold plated. This option is available on commercial and hi-rel
product in 8 and 16 pin DIP. DSCC drawing part numbers contain provisions for lead finish. All
leadless chip carrier devices are delivered with solder dipped terminals as a standard feature.
300
Surface mountable hermetic optocoupler with leads cut and bent for gull wing assembly. This option
is available on commercial and hi-rel product in 8 and 16 pin DIP (see drawings below for details).
This option has solder dipped leads.
Hermetic Optocoupler Options
1.14 (0.045)
1.40 (0.055)
4.32 (0.170)
MAX.
0.51 (0.020)
MAX.
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MIN.
7.36 (0.290)
7.87 (0.310)
0.20 (0.008)
0.33 (0.013)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
1.14 (0.045)
1.40 (0.055)
4.32 (0.170)
MAX.
0.51 (0.020)
MAX.
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MIN.
1.40 (0.055)
1.65 (0.065)
4.57 (0.180)
MAX.
0.51 (0.020)
MAX.
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MIN.
0.51 (0.020)
MIN.
4.57 (0.180)
MAX.
0.51 (0.020)
MAX.
2.29 (0.090)
2.79 (0.110)
1.40 (0.055)
1.65 (0.065)
9.65 (0.380)
9.91 (0.390)
5˚ MAX.
4.57 (0.180)
MAX.
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
0.20 (0.008)
0.33 (0.013)


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