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540MW7C データシート(PDF) 6 Page - HB Electronic Components |
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540MW7C データシート(HTML) 6 Page - HB Electronic Components |
6 / 10 page LED LAMP APPLICATION SOLDERING METHOD SOLDERING CONDITIONS REMARK DIP SOLDERING Bath temperature: 260±5℃ Immersion time: with 5 sec Solder no closer than 3mm from the base of the package Using soldering flux,” RESIN FLUX” is recommended. SOLDERING IRON Soldering iron: 30W or smaller Temperature at tip of iron: 260 or lower ℃ Soldering time: within 5 sec. During soldering, take care not to press the tip of iron against the lead. (To prevent heat from being transferred directly to the lead, hold the lead with a pair of tweezers while soldering 1) When soldering the lead of LED in a condition that the package is fixed with a panel (See Fig.1), be careful not to stress the leads with iron tip. 2) When soldering wire to the lead, work with a Fig (See Fig.2) to avoid stressing the package. Page : 5 P a n e l (Fig.1) L e a d w r i e s L e a v e a s l i g h t c l e a r a n c e L e a d w r i e s ( Fig. 2) |
同様の部品番号 - 540MW7C |
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同様の説明 - 540MW7C |
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