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LM27965SQX データシート(PDF) 3 Page - National Semiconductor (TI) |
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LM27965SQX データシート(HTML) 3 Page - National Semiconductor (TI) |
3 / 13 page Absolute Maximum Ratings (Notes 1, 2) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. V IN pin voltage -0.3V to 6.0V SCL, SDIO, VIO, RESET pin voltages -0.3V to (V IN+0.3V) w/ 6.0V max I Dxx Pin Voltages -0.3V to (V POUT+0.3V) w/ 6.0V max Continuous Power Dissipation (Note 3) Internally Limited Junction Temperature (T J-MAX) 150oC Storage Temperature Range -65oC to +150o C Maximum Lead Temperature (Soldering) (Note 4) ESD Rating(Note 5) Human Body Model 2.0kV Operating Rating (Notes 1, 2) Input Voltage Range 2.7V to 5.5V LED Voltage Range 2.0V to 4.0V Junction Temperature (T J) Range -30˚C to +100˚C Ambient Temperature (T A) Range(Note 6) -30˚C to +85˚C Thermal Properties Junction-to-Ambient Thermal Resistance ( θ JA), SQA24A Package (Note 7) 41.3˚C/W ESD Caution Notice National Semiconduc- tor recommends that all integrated circuits be handled with appropriate ESD precautions. Failure to observe proper ESD handling techniques can result in damage to the device. Electrical Characteristics (Notes 2, 8) Limits in standard typeface are for T J = 25˚C, and limits in boldface type apply over the full operating temperature range. Un- less otherwise specified: V IN = 3.6V; VRESET =VIN; VIO = 1.8V VDxA =VDxB =VDxC = 0.4V; RSET = 12.7k Ω; BankA = BankB = BankC = Fullscale Current; ENA, ENB, ENC, EN5A, EN3B Bits = “1”; C1 = C2 = C IN=COUT= 1.0µF; Specifications related to output current(s) and current setting pins (I Dxx and ISET) apply to BankA and BankB. (Note 9) Symbol Parameter Condition Min Typ Max Units I Dxx Output Current Regulation BankA or BankB Enabled 3.0V ≤ V IN ≤ 5.5V ENA = ’1’ or ENB = ’1’ and ENC= ’0’ 18.2 (-9.5%) 20.1 22.0 (+9.5%) mA (%) Output Current Regulation BankC Enabled 3.0V ≤ V IN ≤ 5.5V ENC = ’1’ and ENA = ENB= ’0’ 19.2 (-7.7%) 20.8 22.4 (+7.7%) mA (%) Maximum Diode Current per Dxx Output(Note 10) R SET = 8.33k Ω 30 mA Output Current Regulation BankA, BankB, and BankC Enabled (Note 10) 3.2V ≤ V IN ≤ 5.5V V LED = 3.6V 20 DxA mA 20 DxB 20 DxC I Dxx-MATCH LED Current Matching(Note 11) 3.0V ≤ V IN ≤ 5.5V BankA 0.3 1.7 % BankB 0.3 1.4 R OUT Open-Loop Charge Pump Output Resistance Gain = 3/2 2.75 Ω Gain = 1 1 V DxTH V Dxx 1x to 3/2x Gain Transition Threshold V DxA and/or VDxB Falling R SET = 16.9k Ω 175 mV V HR Current sink Headroom Voltage Requirement (Note 12) I Dxx = 95% xIDxx (nom.) (I Dxx (nom) ≈ 15mA) R SET = 16.9k Ω 110 mV I Q Quiescent Supply Current Gain = 1.5x, No Load 2.90 3.32 mA I SD Shutdown Supply Current All ENx bits = "0" 3.4 5.4 µA V SET I SET Pin Voltage 2.7V ≤ V IN ≤ 5.5V 1.25 V I DxA-B-C / I SET Output Current to Current Set Ratio BankA, BankB, BankC 200 f SW Switching Frequency 0.89 1.27 1.57 MHz t START Start-up Time P OUT = 90% steady state 250 µs www.national.com 3 |
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