AM29PDL129H63VKI datasheet(11/49 Pages) SPANSION

部品番号	AM29PDL129H63VKI

部品情報	128 Megabit (8 M x 16-Bit) CMOS 3.0 Volt-only, Page Mode Simultaneous Read/Write Flash Memory with Enhanced VersatileIO Control and Dual chip Enable

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11 / 49 page

November 2, 2005

Am29PDL129H

9

DEVICE BUS OPERATIONS

Table 1.

Am29PDL129H Device Bus Operations

Legend: L = Logic Low = VIL, H = Logic High = VIH, VID = 11.5–12.5 V, VHH = 8.5–9.5 V, X = Don’t Care, SA = Sector Address,

AIN = Address In, DIN = Data In, DOUT = Data Out

Notes:

1. The sector protect and sector unprotect functions may also be implemented via programming equipment. .

2. WP#/ACC must be high when writing to sectors SA1-133, SA1-134, SA2-0, or SA2-1.

Random Read (Non-Page Read)

Address access time (tACC) is equal to the delay from

stable addresses to valid output data. The chip enable

access time (tCE) is the delay from the stable ad-

dresses and stable CE# to valid data at the output in-

puts. The output enable access time is the delay from

the falling edge of the OE# to valid data at the output

inputs (assuming the addresses have been stable for

at least tACC–tOE time).

Page Mode Read

The device is capable of fast page mode read and is

compatible with the page mode Mask ROM read oper-

ation. This mode provides faster read access speed

for random locations within a page. Address bits A21–

A3 select an 8-word page, and address bits A2–A0 se-

lect a specific work within that page. This is an asyn-

chronous operation with the microprocessor supplying

the specific word location.

The random or initial page access is tACC or tCE and

subsequent page read accesses (as long as the loca-

tions specified by the microprocessor fall within that

page) are tPACC. When CE1# and CE2# are deas-

serted (CE1#=CE2#=VIH), the reassertion of CE1# or

CE2# for subsequent access has access time of tACC

or tCE. Here again, CE1#/CE2# selects the device and

OE# is the output control and should be used to gate

data to the output inputs if the device is selected. Fast

page mode accesses are obtained by keeping A21–

A3 constant and changing A2 to A0 to select the spe-

cific word within that page.

Table 2.

Page Select

Simultaneous Operation

In addition to the conventional features (read, pro-

gram, erase-suspend read, and erase-suspend pro-

gram), the device is capable of reading data from one

bank of memory while a program or erase operation is

in progress in another bank of memory (simultaneous

operation), The bank can be selected by bank ad-

dresses (A21–A20) with zero latency.

The simultaneous operation can execute multi-func-

tion mode in the same bank.

Operation

CE1#

CE2#

OE#

WE#

RESET#

WP#/ACC

Addresses

(A21–A0)

DQ15–

DQ0

Read

LH

H

X

AIN

DOUT

HL

Write

LH

HL

H

X

(Note 2)

AIN

DIN

HL

Standby

VIO±

0.3 V

VIO ±

0.3 V

XX

VIO ±

0.3 V

XX

High-Z

Output Disable

L

H

X

High-Z

Reset

X

L

X

High-Z

Temporary Sector Unprotect (High

Voltage)

XX

X

VID

XAIN

DIN

Word

A2

A1

A0

Word 0

0

Word 1

0

1

Word 2

0

1

0

Word 3

0

1

Word 4

1

0

Word 5

1

0

1

Word 6

1

0

Word 7

1

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