NE321000

NE321000 (CHIP)

GATE

DRAIN

58

27

56

38

300

38

56

26

61

Note: All dimensions are typical unless otherwise specified

Bonding Pad Area

Chip Thickness: 140 µm typical

PART NUMBER

QUALITY GRADE

NE321000

Standard (Grade D)

ORDERING INFORMATION

NOISE PARAMETERS

FREQ.(GHz)

MAG

ANG (DEG)

2.0

0.21

19.5

0.94

3.7

0.31

4.0

0.22

17.6

0.87

8.2

0.31

6.0

0.24

15.9

0.82

13.3

0.32

8.0

0.26

14.6

0.77

18.8

0.32

10.0

0.28

13.5

0.73

24.8

0.32

12.0

0.31

12.7

0.69

31.4

0.31

14.0

0.38

12.1

0.67

38.4

0.31

16.0

0.45

11.6

0.64

45.9

0.30

18.0

0.52

11.3

0.63

53.9

0.29

20.0

0.59

11.2

0.62

62.4

0.28

22.0

0.66

11.1

0.61

71.4

0.27

24.0

0.72

11.2

0.62

80.8

0.25

26.0

0.79

11.2

0.63

90.8

0.23

Γ

Γ

Γ

Γ

Γopt