TPA731

700mW MONO LOW VOLTAGE AUDIO POWER AMPLIFIER

WITH DIFFERENTIAL INPUTS

SLOS315B − JUNE 2000 − REVISED OCTOBER 2002

2

POST OFFICE BOX 655303

AVAILABLE OPTIONS

PACKAGED DEVICES

MSOP

TA

SMALL OUTLINE†

(D)

MSOP‡

(DGN)

MSOP

SYMBOLIZATION

−40

°C to 85°C

TPA731D

TPA731DGN

AJC

† In the SOIC package, the maximum RMS output power is thermally limited to 350 mW; 700 mW

peaks can be driven, as long as the RMS value is less than 350 mW.

‡ The D and DGN packages are available taped and reeled. To order a taped and reeled part, add

the suffix R to the part number (e.g., TPA731DR).

Terminal Functions

TERMINAL

I/O

DESCRIPTION

NAME

NO.

I/O

DESCRIPTION

BYPASS

2

I

BYPASS is the tap to the voltage divider for internal mid-supply bias. This terminal should be connected to

a 0.1-

µF to 2.2-µF capacitor when used as an audio amplifier.

GND

7

GND is the ground connection.

IN −

4

I

IN − is the inverting input. IN − is typically used as the audio input terminal.

IN+

3

I

IN + is the noninverting input. IN + is typically tied to the BYPASS terminal for SE operations.

SHUTDOWN

1

I

SHUTDOWN places the entire device in shutdown mode when held high (IDD = 1.5 nA).

VDD

6

VDD is the supply voltage terminal.

VO+

5

O

VO+ is the positive BTL output.

VO−

8

O

VO− is the negative BTL output.

6 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Continuous total power dissipation

Internally limited (see Dissipation Rating Table)

. . . . . . . . . . . . . . . . . . . . .

−40

°C to 85°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

−40

°C to 150°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

−65

°C to 150°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds

260

°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

§ Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

DISSIPATION RATING TABLE

PACKAGE

TA ≤ 25°C

DERATING FACTOR

TA = 70°C

TA = 85°C

D

725 mW

5.8 mW/

°C

464 mW

377 mW

DGN

2.14 W¶

17.1 mW/

°C

1.37 W

1.11 W

¶ Please see the Texas Instruments document, PowerPAD Thermally Enhanced Package Application Report

(SLMA002), for more information on the PowerPAD package. The thermal data was measured on a PCB

layout based on the information in the section entitled Texas Instruments Recommended Board for PowerPAD

on page 33 of that document.

recommended operating conditions

MIN

MAX

UNIT

Supply voltage, VDD

2.5

5.5

V

High-level voltage, VIH (SHUTDOWN)

0.9VDD

V

Low-level voltage, VIL (SHUTDOWN)

0.1VDD

V

Operating free-air temperature, TA

−40

85

°C