データシートサーチシステム |
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CDCL6010RGZTG4 データシート(PDF) 6 Page - Texas Instruments |
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CDCL6010RGZTG4 データシート(HTML) 6 Page - Texas Instruments |
6 / 24 page www.ti.com DEVICE INFORMATION VCP AV DD CLKP CLKN AV DD YP0 YN0 V DD YP1 YN1 V DD V SS ADD0 V DD YN7 YP7 V DD YN6 YP6 V DD YN5 YP5 V DD SDA 1 2 3 4 5 6 7 8 9 10 11 12 36 35 34 33 32 31 30 29 28 27 26 25 CDCL6010 NOTE:Exposedthermalpadmustbesolderedto V SS. CDCL6010 SLLS780 – FEBRUARY 2007 48-PIN QFN (RGZ) (TOP VIEW) The CDCL6010 is available in a 48-pin QFN (RGZ) package with a pin pitch of 0,5mm. The exposed thermal pad serves both thermal and electrical grounding purposes. NOTE: The device must be soldered to ground (VSS) using as many ground vias as possible. The device performance will be severely impacted if the exposed thermal pad is not grounded appropriately. 6 Submit Documentation Feedback |
同様の部品番号 - CDCL6010RGZTG4 |
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同様の説明 - CDCL6010RGZTG4 |
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