PACKAGING INFORMATION

Orderable Device

Status

(1)

Package

Type

Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish

MSL Peak Temp

(3)

SN74LVC861ADBLE

OBSOLETE

SSOP

DB

24

TBD

Call TI

Call TI

SN74LVC861ADBR

ACTIVE

SSOP

DB

24

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74LVC861ADBRE4

ACTIVE

SSOP

DB

24

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74LVC861ADGVR

ACTIVE

TVSOP

DGV

24

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74LVC861ADGVRE4

ACTIVE

TVSOP

DGV

24

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74LVC861ADW

ACTIVE

SOIC

DW

24

25

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74LVC861ADWE4

ACTIVE

SOIC

DW

24

25

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74LVC861ADWR

ACTIVE

SOIC

DW

24

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74LVC861ADWRE4

ACTIVE

SOIC

DW

24

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74LVC861ANSR

ACTIVE

SO

NS

24

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74LVC861ANSRE4

ACTIVE

SO

NS

24

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74LVC861APW

ACTIVE

TSSOP

PW

24

60

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74LVC861APWE4

ACTIVE

TSSOP

PW

24

60

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74LVC861APWLE

OBSOLETE

TSSOP

PW

24

TBD

Call TI

Call TI

SN74LVC861APWR

ACTIVE

TSSOP

PW

24

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74LVC861APWRE4

ACTIVE

TSSOP

PW

24

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74LVC861APWT

ACTIVE

TSSOP

PW

24

250

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74LVC861APWTE4

ACTIVE

TSSOP

PW

24

250

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and

package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS

compatible) as defined above.

PACKAGE OPTION ADDENDUM

www.ti.com

6-Dec-2006

Addendum-Page 1