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MC33941EG データシート(PDF) 3 Page - Freescale Semiconductor, Inc |
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MC33941EG データシート(HTML) 3 Page - Freescale Semiconductor, Inc |
3 / 11 page MC33941 Sensors Freescale Semiconductor 3 Table 1. Maximum Ratings All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device. Rating Symbol Value Unit ELECTRICAL RATINGS Peak VPWR Voltage VPWRPK 40 V Double Battery 1 Minute Maximum TA = 30°C VDBLBAT 26.5 V ESD Voltage Human Body Model (CZAP = 100 pF, RZAP = 1500 W) Machine Model (CZAP = 200 pF, RZAP = 0 W) Charge Device Model (CDM), Robotic (CZAP = 4.0pF) VESD ±2000 ±200 ±1200 V THERMAL RATINGS Storage Temperature TSTG -55 to 150 °C Operating Ambient Temperature TA -0 to 110 °C Operating Junction Temperature TJ -0 to 150 °C Thermal Resistance Junction-to-Ambient (1) Junction-to-Case (2) Junction-to-Board (3) RθJA RθJC RθJB 41 0.2 3.0 °C/W Soldering Temperature (4) Notes 1. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance. In accordance with SEMI G38- 87 and JEDEC JESD51-2 with the single layer board horizontal. 2. Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method (MILSPEC 883 Method 1012.1) with the cold plate temperature used for the case temperature. 3. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface of the board near the package. 4. Terminal soldering temperature limit is for 10 seconds maximum duration. The device is not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device. |
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同様の説明 - MC33941EG |
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