MC10E416, MC100E416

http://onsemi.com

6

Symbol

Characteristic

0°C

25°C

85°C

Unit

Min

Typ

Max

Min

Typ

Max

Min

Typ

Max

Maximum Toggle Frequency

> 2.0

GHz

Propagation Delay to Output

ps

d(Diff)

250

350

500

250

350

500

250

350

500

D(SE)

200

350

550

200

350

550

200

350

550

Within-Device Skew (Note 14)

50

50

50

ps

Duty Cycle Skew (Note 15)

±10

±10

±10

ps

Random Clock Jitter (RMS)

< 1

< 1

< 1

ps

(Differential Configuration)

150

1000

150

1000

150

1000

mV

Rise/Fall Time

ps

(20 - 80%)

100

200

350

100

200

350

100

200

350

NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit

board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared

operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit

values are applied individually under normal operating conditions and not valid simultaneously.

14.Within-device skew is defined as identical transitions on similar paths through a device.

15.Duty cycle skew defined only for differential operation when the delays are measured from the cross point of the inputs to the cross point

of the outputs.