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MC74LVXT8051MEL データシート(PDF) 9 Page - ON Semiconductor

部品番号 MC74LVXT8051MEL
部品情報  Analog Multiplexer / Demultiplexer High?뭁erformance Silicon?묰ate CMOS
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メーカー  ONSEMI [ON Semiconductor]
ホームページ  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

MC74LVXT8051MEL データシート(HTML) 9 Page - ON Semiconductor

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MC74LVXT8051
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9
RL
Figure 12. Crosstalk Between Any Two
Switches, Test Set−Up
Figure 13. Power Dissipation Capacitance,
Test Set−Up
Figure 14a. Total Harmonic Distortion, Test Set−Up
Figure 14b. Plot, Harmonic Distortion
0
−10
−20
−30
−40
−50
− 100
1.0
2.0
3.125
FREQUENCY (kHz)
−60
−70
−80
−90
FUNDAMENTAL FREQUENCY
DEVICE
SOURCE
ON
6
8
16
CL*
*Includes all probe and jig capacitance
OFF
RL
RL
VIS
RL
CL*
VOS
fin
0.1mF
ON/OFF
6
8
16
VCC
CHANNEL SELECT
NC
COMMON O/I
OFF/ON
ANALOG I/O
VCC
A
11
VCC
ON
6
8
16
VCC
0.1mF
CL*
fin
RL
TO
DISTORTION
METER
*Includes all probe and jig capacitance
VOS
VIS
APPLICATIONS INFORMATION
The Channel Select and Enable control pins should be at
VCC or GND logic levels. VCC being recognized as a logic
high and GND being recognized as a logic low. In this
example:
VCC = +5V = logic high
GND = 0V = logic low
The maximum analog voltage swing is determined by the
supply voltage VCC. The positive peak analog voltage
should not exceed VCC. Similarly, the negative peak analog
voltage should not go below GND. In this example, the
difference between VCC and GND is five volts. Therefore,
using the configuration of Figure 15, a maximum analog
signal of five volts peak−to−peak can be controlled. Unused
analog inputs/outputs may be left floating (i.e., not
connected). However, tying unused analog inputs and
outputs to VCC or GND through a low value resistor helps
minimize crosstalk and feedthrough noise that may be
picked up by an unused switch.
Although used here, balanced supplies are not a
requirement. The only constraints on the power supplies are
that:
VCC − GND = 2 to 6 volts
When voltage transients above VCC and/or below GND
are anticipated on the analog channels, external Germanium
or Schottky diodes (Dx) are recommended as shown in
Figure 16. These diodes should be able to absorb the
maximum anticipated current surges during clipping.


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