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BZX284-C30 データシート(PDF) 6 Page - NXP Semiconductors |
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BZX284-C30 データシート(HTML) 6 Page - NXP Semiconductors |
6 / 12 page 1999 Apr 19 6 Philips Semiconductors Product specification Voltage regulator diodes BZX284 series THERMAL CHARACTERISTICS Note 1. Device mounted on a printed-circuit board: 11 × 25 × 1.6 mm. SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth j-a thermal resistance from junction to ambient note 1 315 K/W MOUNTING Reflow soldering Follow standard reflow soldering techniques to ensure correct application of solder paste and placement of the SOD110 package (see Fig.2). Dimensions in mm. Fig.2 SOD110 reflow soldering pattern. handbook, halfpage MGC119 ,, ,, ,,, ,,, 3.00 1.25 1.00 1.00 ,, ,, ,,, ,,, Wave soldering Before wave soldering, attach SOD110 packages to the printed-circuit boards using a small dot of thermo-setting epoxy or UV-curing adhesive centred between the soldering lands (see Fig.3). Dimensions in mm. Fig.3 SOD110 wave soldering pattern. handbook, halfpage MGC126 ,, ,, 3.40 1.25 1.10 ,, ,, ,,, ,,, 1.10 ,,, ,,, |
同様の部品番号 - BZX284-C30 |
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同様の説明 - BZX284-C30 |
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