データシートサーチシステム |
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LMV1032UP-25 データシート(PDF) 4 Page - National Semiconductor (TI) |
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LMV1032UP-25 データシート(HTML) 4 Page - National Semiconductor (TI) |
4 / 12 page Connection Diagram Large Dome 4-Bump micro SMD 20084203 Top View Note: - Pin numbers are referenced to package marking text orientation. - The actual physical placement of the package marking will vary slightly from part to part. The package will designate the date code and will vary considerably. Package marking does not correlate to device type in any way. Ordering Information Package Part Number Package Marking Transport Media NSC Drawing Product Status 4-Bump Ultra Thin micro SMD (LDB) Lead Free LMV1032UR-15 Date Code 250 Units Tape and Reel URA04JJA Full Production LMV1032URX-15 3k Units Tape and Reel LMV1032UR-25 Date Code 250 Units Tape and Reel Full Production LMV1032URX-25 3k Units Tape and Reel 4-Bump Ultra Thin micro SMD (Small Bump) Lead Free LMV1032UP-06 Date Code 250 Units Tape and Reel UPA04QQA Full Production LMV1032UPX-06 250 Units Tape and Reel LMV1032UP-15 Date Code 250 Units Tape and Reel Life Time Buy LMV1032UPX-15 3k Units Tape and Reel LMV1032UP-25 Date Code 250 Units Tape and Reel Life Time Buy LMV1032UPX-25 3k Units Tape and Reel Note: The LMV1032 series is offered only with lead free (NOPB) solder bumps. The LMV1032 series replaces the LMV1014. www.national.com 4 |
同様の部品番号 - LMV1032UP-25 |
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同様の説明 - LMV1032UP-25 |
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