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SLX-2143 データシート(PDF) 7 Page - SIRENZA MICRODEVICES |
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SLX-2143 データシート(HTML) 7 Page - SIRENZA MICRODEVICES |
7 / 7 page 522 Almanor Ave., Sunnyvale, CA 94085 Phone: (800) SMI-MMIC http://www.sirenza.com 7 EDS-102501 Rev B Preliminary SLX-2143 1700-2200 MHz LNA Module Solder Reflow The module is designed to be soldered onto a pad that has an array of via holes for improved grounding. Note that the module is reasonably tolerant of voids in the solder cov- erage on the back, but that voids should be avoided because they can result in an increase in thermal imped- ance, which will result in the module running too hot. The gold content on the back is very small so solder embrittle- ment will not be a problem. The module can be assembled onto a circuit board using standard oven or IR reflow profiles. It is difficult to rec- ommend any single reflow profile because such profiles depend on the board size, other components on the board, and the reflow equipment in use. The most critical parame- ter is the peak temperature. Reflow profiles that have a peak temperature on the order of 220ºC-240ºC for 30 sec- onds will be adequate for this part. Lower peak tempera- tures can be used if the time is increased. For small volume prototype fabrication and rework, a hot plate running at about 250ºC is recommended, with the part left on only until the solder reflows. Soldering irons are not recommended for mounting or removing the part. There is a thermal coefficient of expansion mismatch between the module and typical circuit board material, but the small dimensions of the module make the strain induced into the module minimal, so no stress related prob- lems should be encountered. If the module is mounted on a very thin laminate (such as FR-4 0.032” (0.81mm) or less), then care should be taken to avoid flexing the laminate, as the ceramic substrate could crack. This has not been observed on conventional thick circuit board materials. (The evaluation board is a three layer structure with two .032” thick dielectric layers.) Conclusion The SLX-2143 has been designed to be both easy to use and robust, and lab tests done at Sirenza Microdevices have repeatedly demonstrated this. By following the guide- lines in this application note, excellent performance can be achieved. We hope that this application note and the prod- ucts offered by Sirenza Microdevices will assist you in achieving your design goals. If there are any questions about this module or any other Sirenza Microdevices part, please contact us at apps@sirenza.com. Figure 1: Evaluation Board Layout |
同様の部品番号 - SLX-2143 |
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同様の説明 - SLX-2143 |
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