データシートサーチシステム |
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AM29F010B90DTI1 データシート(PDF) 6 Page - Advanced Micro Devices |
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AM29F010B90DTI1 データシート(HTML) 6 Page - Advanced Micro Devices |
6 / 14 page 4 Am29F010B Known Good Die SU PP L E ME NT PAD DESCRIPTION Note: The coordinates above are relative to the center of pad 1 and can be used to operate wire bonding equipment. Pad Signal Pad Center (mils) Pad Center (millimeters) X YXY 1VCC 0.00 0.00 0.00 0.00 2 A16 –6.78 0.00 –0.17 0.00 3 A15 –12.20 0.00 –0.31 0.00 4 A12 –18.03 0.00 –0.46 0.00 5 A7 –23.46 0.00 –0.60 0.00 6 A6 –29.29 0.00 –0.74 0.00 7 A5 –34.72 0.00 –0.88 0.00 8 A4 –41.75 –5.01 –1.06 –0.13 9 A3 –41.14 –116.93 –1.04 –2.97 10 A2 –41.30 –134.13 –1.05 –3.41 11 A1 –35.88 –134.13 –0.91 –3.41 12 A0 –30.04 –134.13 –0.76 –3.41 13 D0 –23.81 –133.31 –0.60 –3.39 14 D1 –17.89 –133.31 –0.45 –3.39 15 D2 –12.06 –133.31 –0.31 –3.39 16 VSS –6.40 –133.31 –0.16 –3.39 17 D3 –0.59 –133.31 –0.01 –3.39 18 D4 5.25 –133.31 0.13 –3.39 19 D5 11.16 –133.31 0.28 –3.39 20 D6 17.00 –133.31 0.43 –3.39 21 D7 22.92 –133.31 0.58 –3.39 22 CE# 29.09 –134.37 0.74 –3.41 23 A10 35.02 –134.13 0.89 –3.41 24 OE# 34.68 –116.93 0.88 –2.97 25 A11 35.45 –5.01 0.90 –0.13 26 A9 29.27 –0.25 0.74 –0.01 27 A8 23.34 0.00 0.59 0.00 28 A13 17.92 0.00 0.46 0.00 29 A14 12.08 0.00 0.31 0.00 30 WE# 6.66 0.00 0.17 0.00 |
同様の部品番号 - AM29F010B90DTI1 |
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同様の説明 - AM29F010B90DTI1 |
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