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AM29DS320GB90WMIN データシート(PDF) 4 Page - SPANSION

部品番号 AM29DS320GB90WMIN
部品情報  32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 1.8 Volt-only, Simultaneous Operation Flash Memory
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January 27, 2003
Am29DS320G
3
AD VA NCE
I N FO RM ATI O N
TABLE OF CONTENTS
Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 4
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . 5
Special Package Handling Instructions .......................................... 5
Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 7
Device Bus Operations . . . . . . . . . . . . . . . . . . . . . . 8
Table 1. Device Bus Operations .............................................................8
Word/Byte Configuration ................................................................ 8
Requirements for Reading Array Data ...........................................8
Writing Commands/Command Sequences .................................... 9
Accelerated Program Operation .....................................................9
Autoselect Functions ...................................................................... 9
Simultaneous Read/Write Operations
with Zero Latency ...........................................................................9
Standby Mode ................................................................................ 9
Automatic Sleep Mode ...................................................................9
RESET#: Hardware Reset Pin .....................................................10
Output Disable Mode ...................................................................10
Table 2. Top Boot Sector Addresses ...................................................11
Table 3. Top Boot SecSi
TM Sector Addresses ..................................... 12
Table 4. Bottom Boot Sector Addresses ...............................................13
Table 5. Bottom Boot SecSiTM Sector Addresses ................................ 14
Autoselect Mode .......................................................................... 15
Table 6. Autoselect Codes, (High Voltage Method) .............................15
Sector/Sector Block Protection and Unprotection ........................ 16
Table 7. Top Boot Sector/Sector Block Addresses
for Protection/Unprotection ...................................................................16
Table 8. Bottom Boot Sector/Sector Block Addresses
for Protection/Unprotection ...................................................................16
Write Protect (WP#) .....................................................................17
Temporary Sector Unprotect ........................................................ 17
Figure 1. Temporary Sector Unprotect Operation ................................. 17
Figure 2. In-System Sector Protection/
Sector Unprotection Algorithms ............................................................ 18
SecSi
TM (Secured Silicon) Sector
Flash Memory Region .................................................................. 19
Factory Locked: SecSi Sector Programmed and Protected At the
Factory .........................................................................................19
Customer Lockable: SecSi Sector NOT Programmed or Protected At
the Factory ...................................................................................19
Figure 3. SecSi Sector Protect Verify.................................................... 20
Hardware Data Protection ............................................................ 20
Low VCC Write Inhibit .................................................................. 20
Write Pulse “Glitch” Protection .....................................................20
Logical Inhibit ...............................................................................20
Power-Up Write Inhibit .................................................................20
Common Flash Memory Interface (CFI) . . . . . . . 21
Table 9. CFI Query Identification String ................................................ 21
Table 10. System Interface String......................................................... 22
Table 11. Device Geometry Definition .................................................. 22
Table 12. Primary Vendor-Specific Extended Query ............................ 23
Command Definitions . . . . . . . . . . . . . . . . . . . . . . 23
Reading Array Data ...................................................................... 23
Reset Command .......................................................................... 24
Autoselect Command Sequence .................................................. 24
Enter SecSiTM Sector/Exit SecSi Sector
Command Sequence ...................................................................24
Byte/Word Program Command Sequence ...................................24
Unlock Bypass Command Sequence ........................................... 25
Figure 4. Program Operation ................................................................ 25
Chip Erase Command Sequence ................................................. 25
Sector Erase Command Sequence .............................................. 26
Erase Suspend/Erase Resume Commands ................................ 26
Figure 5. Erase Operation .................................................................... 27
Table 13. Command Definitions ........................................................... 28
Write Operation Status . . . . . . . . . . . . . . . . . . . . 29
DQ7: Data# Polling ...................................................................... 29
Figure 6. Data# Polling Algorithm ......................................................... 29
RY/BY#: Ready/Busy# ................................................................. 30
DQ6: Toggle Bit I .......................................................................... 30
Figure 7. Toggle Bit Algorithm .............................................................. 30
DQ2: Toggle Bit II ......................................................................... 31
Reading Toggle Bits DQ6/DQ2 .................................................... 31
DQ5: Exceeded Timing Limits ...................................................... 31
DQ3: Sector Erase Timer ............................................................. 31
Table 14. Write Operation Status ......................................................... 32
Absolute Maximum Ratings . . . . . . . . . . . . . . . . 33
Figure 8. Maximum Negative Overshoot Waveform ............................. 33
Figure 9. Maximum Positive Overshoot Waveform .............................. 33
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 34
Figure 10. ICC1 Current vs. Time (Showing Active and
Automatic Sleep Currents).................................................................... 35
Figure 11. Typical ICC1 vs. Frequency................................................... 35
Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Figure 12. Test Setup .......................................................................... 36
Figure 13. Input Waveforms and Measurement Levels ........................ 36
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 37
Figure 14. Read Operation Timings...................................................... 37
Figure 15. Reset Timings...................................................................... 38
Word/Byte Configuration (BYTE#) ............................................... 39
Figure 16. BYTE# Timings for Read Operations .................................. 39
Figure 17. BYTE# Timings for Write Operations .................................. 39
Erase and Program Operations ................................................... 40
Figure 18. Program Operation Timings ................................................ 41
Figure 19. Accelerated Program Timing Diagram ................................ 41
Figure 20. Chip/Sector Erase Operation Timings ................................. 42
Figure 21. Back-to-back Read/Write Cycle Timings ............................. 43
Figure 22. Data# Polling Timings (During Embedded Algorithms) ....... 43
Figure 23. Toggle Bit Timings (During Embedded Algorithms) ............ 44
Figure 24. DQ2 vs. DQ6 ....................................................................... 44
Temporary Sector Unprotect ........................................................ 45
Figure 25. Temporary Sector Unprotect Timing Diagram ..................... 45
Figure 26. Sector/Sector Block Protect and Unprotect Timing Diagram 46
Alternate CE# Controlled Erase and Program Operations ........... 47
Figure 27. Alternate CE# Controlled Write (Erase/Program)
Operation Timings ................................................................................ 48
Erase And Programming Performance . . . . . . . 49
Latchup Characteristics . . . . . . . . . . . . . . . . . . . . 49
TSOP And SO Pin Capacitance . . . . . . . . . . . . . . 49
Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 50
FBD048—Fine-Pitch Ball Grid Array, 6 x 12 mm ......................... 50
TS 048—Thin Small Outline Package .......................................... 51
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 52
Revision A (May 14, 2002) ........................................................... 52
Revision A+1 (January 3, 2003) ................................................... 52


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