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AM50DL9608GT75IT データシート(PDF) 2 Page - SPANSION |
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2 / 70 page  PRELIMINARY This document contains information on a product under development at Advanced Micro Devices. The information is intended to help you evaluate this product. AMD reserves the right to change or discontinue work on this proposed product without notice. 5/19/03 Publication# 27025 Rev:A Amendment/+4 Issue Date: May 19, 2003 Refer to AMD’s Website (www.amd.com) for the latest information. Am50DL9608G Stacked Multi-Chip Package (MCP) Flash Memory and Pseudo SRAM 64 Megabit (4 M x 16-Bit) and 32 Megabit (2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memories, and 8 Mbit (512 K x 16-Bit) Pseudo Static RAM DISTINCTIVE CHARACTERISTICS MCP Features ■ Power supply voltage of 2.7 to 3.3 volt ■ High performance — Flash access time as fast as 70 ns — Pseudo SRAM access time as fast as 55 ns ■ Package — 73-Ball FBGA ■ Operating Temperature — –40°C to +85°C Flash Memory Features (Am29DL640G/Am29DL320G) — Features apply to Am29DL640G and Am29DL320G independently. ARCHITECTURAL ADVANTAGES ■ Simultaneous Read/Write operations — Data can be continuously read from one bank while executing erase/program functions in another bank. — Zero latency between read and write operations ■ Flexible Bank architecture — Read may occur in any of the three banks not being written or erased. — Four banks may be grouped by customer to achieve desired bank divisions. ■ Manufactured on 0.17 µm process technology ■ SecSi™ (Secured Silicon) Sector — Extra 256 byte sector on Am29DL640G — Extra 256 byte sector on Am29DL320G — Factory locked and identifiable: 16 bytes available for secure, random factory Electronic Serial Number; verifiable as factory locked through autoselect function. ExpressFlash option allows entire sector to be available for factory-secured data — Customer lockable: Sector is one-time programmable. Once sector is locked, data cannot be changed. ■ Zero Power Operation — Sophisticated power management circuits reduce power consumed during inactive periods to nearly zero. ■ Boot sectors — Top and bottom boot sectors in Am29DL640G — Top or bottom boot options in Am29DL320G ■ Compatible with JEDEC standards — Pinout and software compatible with single-power-supply flash standard PERFORMANCE CHARACTERISTICS ■ High performance — Access time as fast as 70 ns — Program time: 4 µs/word typical utilizing Accelerate function ■ Ultra low power consumption (typical values) — 2 mA active read current at 1 MHz — 10 mA active read current at 5 MHz — 200 nA in standby or automatic sleep mode ■ Minimum 1 million erase cycles guaranteed per sector ■ 20 year data retention at 125 °C — Reliable operation for the life of the system SOFTWARE FEATURES ■ Supports Common Flash Memory Interface (CFI) ■ Program/Erase Suspend/Erase Resume — Suspends program/erase operations to allow programming/erasing in same bank ■ Data# Polling and Toggle Bits — Provides a software method of detecting the status of program or erase cycles HARDWARE FEATURES ■ Any combination of sectors can be erased ■ Ready/Busy# output (RY/BY#) — Hardware method for detecting program or erase cycle completion ■ Hardware reset pin (RESET#) — Hardware method of resetting the internal state machine to the read mode ■ WP#/ACC input pin — Write protect (WP#) protects sectors 0, 1, 140, and 141 in Am29DL640G, and two outermost boot sectors in Am29DL320G — Acceleration (ACC) function accelerates program timing ■ Sector protection — Hardware method of locking a sector, either in-system or using programming equipment, to prevent any program or erase operation within that sector — Temporary Sector Unprotect allows changing data in protected sectors in-system Pseudo SRAM Features ■ Power dissipation — Operating: 30 mA maximum — Standby: 60 µA maximum ■ CE1s# and CE2s Chip Select ■ Power down features using CE1s# and CE2s ■ Data retention supply voltage: 2.7 to 3.3 volt ■ Byte data control: LB#s (DQ7–DQ0), UB#s (DQ15–DQ8) |
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