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74LCXH16374MEA データシート(PDF) 1 Page - Fairchild Semiconductor |
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74LCXH16374MEA データシート(HTML) 1 Page - Fairchild Semiconductor |
1 / 10 page © 2005 Fairchild Semiconductor Corporation DS500441 www.fairchildsemi.com February 2001 Revised June 2005 74LCXH16374 Low Voltage 16-Bit D-Type Flip-Flop with Bushold General Description The LCXH16374 contains sixteen non-inverting D-type flip- flops with 3-STATE outputs and is intended for bus oriented applications. The device is byte controlled. A buffered clock (CP) and Output Enable (OE) are common to each byte and can be shorted together for full 16-bit operation. The LCXH16374 is designed for low voltage (2.5V or 3.3V) VCC applications. The LCXH16374 is fabricated with an advanced CMOS technology to achieve high speed operation while maintain- ing CMOS low power dissipation. The LCXH16374 data inputs include active bushold cir- cuitry, eliminating the need for external pull-up resistors to hold unused or floating data inputs at a valid logic level. Features s 5V tolerant control inputs and outputs s 2.3V–3.6V VCC specifications provided s 6.2 ns tPD max (VCC 3.3V), 20 PA ICC max s Bushold on inputs eliminating the need for external pull-up/pull-down resistors s Power down high impedance outputs s r24 mA output drive (VCC 3.0V) s Implements patented noise/EMI reduction circuitry s Latch-up performance exceeds 500 mA s ESD performance: Human body model ! 2000V Machine model ! 200V s Also packaged in plastic Fine-Pitch Ball Grid Array (FBGA) Ordering Code: Note 1: Ordering code “G” indicates Trays. Note 2: Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code. Logic Symbol GTO ¥ is a trademark of Fairchild Semiconductor Corporation. Order Number Package Number Package Description 74LCXH16374G (Note 1)(Note 3) BGA54A 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide 74LCXH16374MEA (Note 2) MS48A 48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide 74LCXH16374MTD (Note 2) MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide |
同様の部品番号 - 74LCXH16374MEA |
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同様の説明 - 74LCXH16374MEA |
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