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FAN5069MTCX データシート(PDF) 4 Page - Fairchild Semiconductor |
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FAN5069MTCX データシート(HTML) 4 Page - Fairchild Semiconductor |
4 / 22 page © 2005 Fairchild Semiconductor Corporation www.fairchildsemi.com FAN5069 Rev. 1.1.5 4 Absolute Maximum Ratings The “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. The device should not be operated at these limits. The parametric values defined in the Electrical Characteristics tables are not guaranteed at the absolute maximum ratings. The “Recommended Operating Conditions” table defines the condi- tions for actual device operation. (1) Notes: 1. Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Absolute maximum ratings apply individually only, not in combination. Unless otherwise specified, all other voltages are referenced to AGND. 2. Using Mil Std. 883E, method 3015.7(Human Body Model) and EIA/JESD22C101-A (Charge Device Model). Thermal Information Notes: 3. Junction-to-ambient thermal resistance, θ JA, is a strong function of PCB material, board thickness, thickness and number of copper planes, number of vias used, diameter of vias used, available copper surface, and attached heat sink characteristics. Recommended Operating Conditions Parameter Min. Max. Unit VCC to PGND 6.0 V BOOT to PGND 33.0 V SW to PGND Continuous -0.5 33.0 V Transient (t < 50nS, F < 500kHz) -3.0 33.0 V HDRV (VBOOT- – VSW) 6.0 V LDRV -0.5 6.0 V All Other Pins -0.3 VCC + 0.3 V Maximum Shunt Current for VCC 150 mA Electrostatic Discharge Protection (ESD) Level(2) HBM 3.5 kV CDM 1.8 Symbol Parameter Min. Typ. Max. Unit TSTG Storage Temperature -65 150 °C TL Lead Soldering Temperature, 10 Seconds 300 °C Vapor Phase, 60 Seconds 215 °C Infrared, 15 Seconds 220 °C PD Power Dissipation, TA = 25°C 715 mW θ JC Thermal Resistance, Junction-to-Case 37 °C/W θ JA Thermal Resistance, Junction-to-Ambient(3) 100 °C/W Symbol Parameter Conditions Min. Typ. Max. Unit VCC Supply Voltage VCC to GND 4.5 5.0 5.5 V TA Ambient Temperature Commercial -10 85 °C Industrial -40 85 °C TJ Junction Temperature 125 °C |
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同様の説明 - FAN5069MTCX |
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