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FDD5614P データシート(PDF) 3 Page - Fairchild Semiconductor |
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FDD5614P データシート(HTML) 3 Page - Fairchild Semiconductor |
3 / 6 page FDD5614P Rev C1(W) Notes: 1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design. a) RθJA = 40°C/W when mounted on a 1in 2 pad of 2 oz copper b) RθJA = 96°C/W when mounted on a minimum pad. Scale 1 : 1 on letter size paper 2. Pulse Test: Pulse Width < 300 µs, Duty Cycle < 2.0% 3. Maximum current is calculated as: where PD is maximum power dissipation at TC = 25°C and RDS(on) is at TJ(max) and VGS = 10V. Package current limitation is 21A ) ON ( DS D R P |
同様の部品番号 - FDD5614P |
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同様の説明 - FDD5614P |
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