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SI5020C-BA データシート(PDF) 8 Page - Silicon Laboratories |
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SI5020C-BA データシート(HTML) 8 Page - Silicon Laboratories |
8 / 14 page Si5020C-BA 8 Rev. 1.0 High-Speed Serial Input The high-speed serial data inputs (SERDATIP/N) provide data to the Si5020 for clock and data recovery. The SERDATIP/N inputs are internally biased to an input common mode voltage of 2.0 V and provide 100 Ω line-to-line termination. AC coupling is recommended as the simplest coupling approach. (See "Typical Application Schematic" on page 6.) Full details on the SERDATIP/N pins can be found in the Si5020 data sheet DIN± pin descriptions. Recovered Data Output The recovered data outputs (SERDATOP/N) transmit the recovered serial data. These outputs are time aligned to the recovered clock outputs. The SERDATOP/N outputs are current mode logic (CML) outputs. AC coupling is recommended as the simplest coupling approach. (See "Typical Application Schematic" on page 6.) Full details on the SERDATOP/ N pins can be found in the Si5020 data sheet DOUT± pin descriptions. Recovered Clock Output The recovered clock outputs (SERCLKOP/N) transmit the clock recovered from the serial data. These outputs are time aligned to the recovered data outputs. The SERCLKOP/N outputs are CML outputs. AC coupling is recommended as the simplest coupling approach. (See "Typical Application Schematic" on page 6.) Full details on the SERCLKOP/N pins can be found in the Si5020 data sheet CLKOUT± pin descriptions. Soldering/Assembly The Si5020C-BA employs a minimal lead length which is significantly different from a QFP lead. Despite the lead differences, handling of the Si5020C-BA is similar to handling of a QFP. Automation of the alignment and soldering processes will simplify the attachment. Alignment can be accomplished using standard pick- and-place machines. Set the pick point to the center of the Si5020 device; this point is marked within the mechanical drawing. (See Figure 2 on page 12.) Once aligned, soldering the Si5020C-BA to another PCB is best accomplished using solder paste and a reflow chamber. Once the Si5020C-BA is placed upon the solder paste the reflow process can occur. The Si5020C-BA evaluation board itself has been assembled using 220 °C solder in order maintain the locations of the Si5020 device, voltage regulator, inverter, and passive components on the board during the reflow process. |
同様の部品番号 - SI5020C-BA |
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同様の説明 - SI5020C-BA |
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