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MPX5700 データシート(PDF) 3 Page - Freescale Semiconductor, Inc

部品番号. MPX5700
部品情報  Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
ダウンロード  9 Pages
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メーカー  FREESCALE [Freescale Semiconductor, Inc]
ホームページ  http://www.freescale.com
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MPX5700 Datasheet(HTML) 3 Page - Freescale Semiconductor, Inc

   
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Sensors
Freescale Semiconductor
3
MPX5700
ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING
Figure 3 illustrates both the Differential/Gauge and the
Absolute Sensing Chip in the basic chip carrier (Case 867).
A fluorosilicone gel isolates the die surface and wire bonds
from the environment, while allowing the pressure signal to
be transmitted to the sensor diaphragm. (For use of the
MPX5700D in a high-pressure cyclic application, consult the
factory.)
The MPX5700 series pressure sensor operating
characteristics, and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media,
other than dry air, may have adverse effects on sensor
performance and long-term reliability. Contact the factory for
information regarding media compatibility in your application.
Figure 2 shows the sensor output signal relative to
pressure input. Typical, minimum, and maximum output
curves are shown for operation over a temperature range of
0° to 85°C using the decoupling circuit shown in Figure 4. The
output will saturate outside of the specified pressure range.
Figure 4 shows the recommended decoupling circuit for
interfacing the output of the integrated sensor to the A/D input
of a microprocessor or microcontroller. Proper decoupling of
the power supply is recommended.
Figure 2. Output versus Pressure Differential
Figure 3. Cross-Sectional Diagrams (not to scale)
Figure 4. Recommended Power Supply Decoupling and Output Filtering
(For additional output filtering, please refer to Application Note AN1646)
Differential Pressure (kPa)
Typical
Minimum
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
0
100
200
300
400
600
500
Maximum
700
800
Transfer Function:
Vout = VS*(0.0012858*P+0.04) ± Error
VS = 5.0 Vdc
Temperature = 0 to 85°C
Fluoro Silicone
Die Coat
Wire Bond
Die
P1
Stainless Steel
Metal Cover
Lead Frame
RTV Die
Bond
Epoxy Case
P2
Fluoro Silicone
Die Coat
Wire Bond
Die
P1
Stainless Steel
Metal Cover
Lead Frame
RTV Die
Bond
Epoxy Case
P2
ABSOLUTE ELEMENT
DIFFERENTIAL/GAUGE ELEMENT
+5 V
1.0 µF
0.01 µF
470 pF
GND
Vs
Vout
IPS
Output


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