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MPX5999D データシート(PDF) 3 Page - Freescale Semiconductor, Inc

部品番号. MPX5999D
部品情報  Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
ダウンロード  8 Pages
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メーカー  FREESCALE [Freescale Semiconductor, Inc]
ホームページ  http://www.freescale.com
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MPX5999D Datasheet(HTML) 3 Page - Freescale Semiconductor, Inc

   
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Sensors
Freescale Semiconductor
3
MPX5999D
ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING
Figure 2 shows the sensor output signal relative to
pressure input. Typical, minimum, and maximum output
curves are shown for operation over a temperature range of
0
° to 85°C using the decoupling circuit shown in Figure 4. The
output will saturate outside of the specified pressure range.
The performance over temperature is achieved by
integrating the shear-stress strain gauge, temperature
compensation, calibration and signal conditioning circuitry
onto a single monolithic chip.
Figure 3 illustrates the differential or gauge configuration
in the basic chip carrier (Case 867). A fluoro silicone gel
isolates the die surface and wire bonds from harsh
environments, while allowing the pressure signal to be
transmitted to the silicon diaphragm.
The MPX5999D pressure sensor operating
characteristics, and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media
other than dry air may have adverse effects on sensor
performance and long-term reliability. Contact the factory for
information regarding media compatibility in your application.
Figure 4 shows the recommended decoupling circuit for
interfacing the output of the integrated sensor to the A/D input
of a microprocessor or microcontroller. Proper decoupling of
the power supply is recommended.
Figure 2. Output versus Pressure Differential
Figure 3. Cross-Sectional Diagrams (not to scale)
Figure 4. Recommended Power Supply Decoupling and Output Filtering
(For additional output filtering, please refer to Application Note AN1646)
Differential Pressure (kPa)
TYP
MIN
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
0
100 200 300 400 500
600 700 800
900
1100
1000
MAX
Transfer Function:
Vout = VS*(0.000901*P+0.04) ± Error
VS = 5.0 Vdc
Temperature = 0 to 85°C
Silicone
Die Coat
Wire Bond
Die
P1
Stainless Steel
Metal Cover
Lead Frame
RTV Die
Bond
Thermoplastic Case
P2
+5 V
1.0
µF
0.01
µF
470 pF
GND
Vs
Vout
IPS
Output


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