Sensors

4

Freescale Semiconductor

MPXAZ4100A

chip carrier (Case 482).

Figure 4 shows the sensor output signal relative to

pressure input. Typical, minimum, and maximum output

curves are shown for operation over a temperature range of

0

° to 85°C using the decoupling circuit shown in Figure 3. The

output will saturate outside of the specified pressure range.

A gel die coat isolates the die surface and wire bonds from

the environment, while allowing the pressure signal to be

transmitted to the sensor diaphragm. The gel die coat and

durable polymer package provide a media resistant barrier

that allows the sensor to operate reliably in high humidity

conditions as well as environments containing common

automotive media. Contact the factory for more information

regarding media compatibility in your specific application.

Figure 3 shows the recommended decoupling circuit for

interfacing the output of the integrated sensor to the A/D input

of a microprocessor or microcontroller. Proper decoupling of

the power supply is recommended.

Figure 2. Cross Sectional Diagram SOP

(not to scale)

Figure 3. Recommended Power Supply Decoupling and Output Filtering

(For additional output filtering, please refer to Application Note AN1646.)

Figure 4. Output versus Absolute Pressure

Fluoro Silicone

Gel Die Coat

Wire Bond

Lead Frame

Sealed Vacuum Reference

Absolute Element

Die Bond

Stainless Steel Cap

Thermoplastic Case

P1

Die

+5 V

1.0

µF

0.01

µF

470 pF

GND

IPS

Output

MAX

TYP

MIN

5.0

4.5

3.5

4.0

3.0

2.5

2.0

1.5

1.0

0

0.5

Pressure (ref: to sealed vacuum) in kPa

Transfer Function:

Temperature = 0 to 85°C

20 kPa TO 105 kPa

MPXAZ4100A