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MPXAZ4100A データシート(PDF) 4 Page - Freescale Semiconductor, Inc |
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MPXAZ4100A データシート(HTML) 4 Page - Freescale Semiconductor, Inc |
4 / 8 page Sensors 4 Freescale Semiconductor MPXAZ4100A Figure 2 illustrates an absolute sensing chip in the basic chip carrier (Case 482). Figure 4 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 0 ° to 85°C using the decoupling circuit shown in Figure 3. The output will saturate outside of the specified pressure range. A gel die coat isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The gel die coat and durable polymer package provide a media resistant barrier that allows the sensor to operate reliably in high humidity conditions as well as environments containing common automotive media. Contact the factory for more information regarding media compatibility in your specific application. Figure 3 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended. Figure 2. Cross Sectional Diagram SOP (not to scale) Figure 3. Recommended Power Supply Decoupling and Output Filtering (For additional output filtering, please refer to Application Note AN1646.) Figure 4. Output versus Absolute Pressure Fluoro Silicone Gel Die Coat Wire Bond Lead Frame Sealed Vacuum Reference Absolute Element Die Bond Stainless Steel Cap Thermoplastic Case P1 Die +5 V 1.0 µF 0.01 µF 470 pF GND Vs Vout IPS Output MAX TYP MIN 5.0 4.5 3.5 4.0 3.0 2.5 2.0 1.5 1.0 0 0.5 Pressure (ref: to sealed vacuum) in kPa Transfer Function: Vout = Vs* (.01059*P-.152) ± Error VS = 5.1 Vdc Temperature = 0 to 85°C 20 kPa TO 105 kPa MPXAZ4100A |
同様の部品番号 - MPXAZ4100A |
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同様の説明 - MPXAZ4100A |
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