Control Devices

Microsemi – Lowell

75 Technology Drive, Lowell, MA 01851 Tel. (978) 442-5600

CERAMIC MELF PIN DIODES

• Magnetic/Non-Magnetic“Cer-Met”

(MELF) Packages

• Very Low Inductance, Full Faced

Bonding

• Hermetic, Low Loss and Low Distortion

Applications

• High Volume Manufacturing Capability

• 100% TX Screening Available

DESCRIPTION

This new line of ‘MELF’ high power PIN diodes are

hermetically sealed surface mount packaged devices

with full face bonded chips for low inductance

construction. The MELF ceramic package has square

end terminations which are ideal for surface mount and

pick and place operations. The PIN diode chips are

coated with a special hard glass passivation which is

required for high power applications to enhance the

reliability resulting in MTBF’s of greater than one million

hours.

APPLICATIONS

These MELF diodes are used as switching, attenuating

and phase shifting elements from HF through 2 GHz

and have breakdown voltage ratings up to 700 volts.

Non-magnetic “Cer-Met” (MELF’s) are also used as

switching elements in MRI (magnetic resonance

imaging) applications. Conventional magnetic MELF

packages are used in cellular, beam steering

applications, filter switch banks, and antenna tuning

units..