TDA8357J datasheet(11/16 Pages) PHILIPS

部品番号	TDA8357J

部品情報	Full bridge vertical deflection output circuit in LVDMOS

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メーカー	PHILIPS [NXP Semiconductors]

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11 / 16 page

1999 Nov 10

11

Philips Semiconductors

Preliminary speciﬁcation

Full bridge vertical deﬂection output circuit

in LVDMOS

TDA8357J

Heatsink calculation

The value of the heatsink can be calculated in a standard

way with a method based on average temperatures.

The required thermal resistance of the heatsink is

determined by the maximum die temperature of 150

°C.

In general we recommend to design for an average die

temperature not exceeding 130

°C.

EXAMPLE

Measured or given values: Ptot = 3 W; Tamb =40 °C;

Tj = 110 °C; Rth(j-c) = 5 K/W; Rth(c-h) = 2 K/W.

The required heatsink thermal resistance is given by:

When we use the values given we find:

The heatsink temperature will be:

Th =Tamb +(Rth(h-a) × Ptot) =40+(3 × 16) = 90 °C

R

th h

a

–

()

T

j

T

amb

–

P

tot

------------------------

R

th j

c

–

()

R

th c

h

–

()

+

()

–

=

R

th h

a

–

()

110

40

–

3.0

----------------------

52

+

()

–

16 K/W

==

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