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TS274CD データシート(PDF) 11 Page - STMicroelectronics |
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TS274CD データシート(HTML) 11 Page - STMicroelectronics |
11 / 15 page TS274 Package mechanical data 11/15 6 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 6.1 DIP14 package DIM. mm. inch MIN. TYP MAX. MIN. TYP. MAX. a1 0.51 0.020 B 1.39 1.65 0.055 0.065 b 0.5 0.020 b1 0.25 0.010 D 20 0.787 E 8.5 0.335 e 2.54 0.100 e3 15.24 0.600 F 7.1 0.280 I 5.1 0.201 L 3.3 0.130 Z 1.27 2.54 0.050 0.100 Plastic DIP-14 MECHANICAL DATA P001A |
同様の部品番号 - TS274CD |
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同様の説明 - TS274CD |
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