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TDA7263L データシート(PDF) 7 Page - Texas Instruments |
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TDA7263L データシート(HTML) 7 Page - Texas Instruments |
7 / 10 page 7/10 TDA7263L 6 HEAT SINK DIMENSIONING: In order to avoid the thermal protection intervention, that is placed approximatively at Tj = 150°C, it is important the dimensioning of the Heat Sinker RTh (°C/W). The parameters that influence the dimensioning are: – Maximum dissipated power for the device (Pdmax) – Max thermal resistance Junction to case (RTh j-c) – Max. ambient temperature Tamb max – Quiescent current Iq (mA) 6.1 Example: VCC = 20V, Rload = 8ohm, RTh j-c = 9 °C/W , Tamb max = 50°C Pdmax = (N° channels) · Pdmax = 2 · ( 2.5 ) + 0.5 = 5.5W (Heat Sinker) In figure 11 is shown the Power derating curve for the device. Figure 15. Power Derating Curve 2V cc 2 Π 2 R lo ad ⋅ -------------------------- I q V cc ⋅ + R Th c-a 150 T am b max – P d max ----------------------------------------- R Th j-c – 150 50 – 5.5 ---------------------- 9 – 9.0 °C/W == = a) Infinite Heatsink b) 5.0 °C/ W c) 7.0 °C/ W (c) (a) (b) 0 2 4 6 8 10 0 40 80 120 160 Tamb (°C) a) Infinite Heatsink b) 5.0 °C/ W c) 7.0 °C/ W (c) (a) (b) 0 2 4 6 8 10 0 40 80 120 160 Tamb (°C) |
同様の部品番号 - TDA7263L |
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同様の説明 - TDA7263L |
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