データシートサーチシステム |
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TIPP115 データシート(PDF) 3 Page - Power Innovations Ltd |
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TIPP115 データシート(HTML) 3 Page - Power Innovations Ltd |
3 / 6 page 3 MAY 1989 - REVISED MARCH 1997 TIPP115, TIPP116, TIPP117 PNP SILICON POWER DARLINGTONS PRODUCT INFORMATION LP003 (TO-92) 3-pin cylindical plastic package This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound will withstand soldering temperature with no deformation, and circuit performance characteristics will remain stable when operated in high humidity conditions. Leads require no additional cleaning or processing when used in soldered assembly. MECHANICAL DATA ALL LINEAR DIMENSIONS IN MILLIMETERS 12,7 MIN. 2,03 2,67 4,44 5,21 3,43 MIN. 4,32 5,34 0,40 0,56 1,14 1,40 2,41 2,67 0,35 0,41 2,03 2,67 3,17 4,19 (see Note A) Seating Plane 1 2 3 LP003 (TO-92) LP003 Falls Within JEDEC TO-226AA Dimensions MDXXAX 1,27 NOTE A: Lead dimensions are not controlled in this area. |
同様の部品番号 - TIPP115 |
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同様の説明 - TIPP115 |
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