TIPP110, TIPP111, TIPP112

NPN SILICON POWER DARLINGTONS

4

MAY 1989 - REVISED MARCH 1997

PRODUCT

INFORMATION

LP003 (TO-92)

3-pin cylindical plastic package

This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic

compound. The compound will withstand soldering temperature with no deformation, and circuit performance

characteristics will remain stable when operated in high humidity conditions. Leads require no additional

cleaning or processing when used in soldered assembly.

MECHANICAL DATA

LP003 (TO-92) - Formed Leads Version

ALL LINEAR DIMENSIONS IN MILLIMETERS

2,03

2,67

4,44

5,21

3,43 MIN.

4,32

5,34

0,40

0,56

2,40

2,90

0,35

0,41

2,03

2,67

3,17

4,19

4,00 MAX.

2,90

2,40

LP003 Falls Within JEDEC

TO-226AA Dimensions

1

2

3

MDXXAR