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TIPP112 データシート(PDF) 4 Page - Power Innovations Ltd |
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TIPP112 データシート(HTML) 4 Page - Power Innovations Ltd |
4 / 6 page TIPP110, TIPP111, TIPP112 NPN SILICON POWER DARLINGTONS 4 MAY 1989 - REVISED MARCH 1997 PRODUCT INFORMATION LP003 (TO-92) 3-pin cylindical plastic package This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound will withstand soldering temperature with no deformation, and circuit performance characteristics will remain stable when operated in high humidity conditions. Leads require no additional cleaning or processing when used in soldered assembly. MECHANICAL DATA LP003 (TO-92) - Formed Leads Version ALL LINEAR DIMENSIONS IN MILLIMETERS 2,03 2,67 4,44 5,21 3,43 MIN. 4,32 5,34 0,40 0,56 2,40 2,90 0,35 0,41 2,03 2,67 3,17 4,19 4,00 MAX. 2,90 2,40 LP003 Falls Within JEDEC TO-226AA Dimensions 1 2 3 MDXXAR |
同様の部品番号 - TIPP112 |
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同様の説明 - TIPP112 |
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