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TS3USB31RSERG4 データシート(PDF) 2 Page - Texas Instruments |
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TS3USB31RSERG4 データシート(HTML) 2 Page - Texas Instruments |
2 / 17 page www.ti.com BLOCK DIAGRAM HSD1+ HSD1– Control D+ D– OE Absolute Maximum Ratings (1) Package Thermal Impedance TS3USB31 HIGH-SPEED USB 2.0 (480-Mbps) 1-PORT SWITCH WITH SINGLE ENABLE SCDS242C – JULY 2007 – REVISED AUGUST 2007 TRUTH TABLE OE FUNCTION H Disconnect L D+, D– = HSD+, HSD– over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VCC Supply voltage range –0.5 7 V VIN Control input voltage range(2)(3) –0.5 7 V HSD+, HSD– –0.5 VCC + 0.3 VI/O Switch I/O voltage range(2)(3)(4) D+, D– when VCC > 0 –0.5 VCC + 0.3 V D+, D– when VCC = 0 5.25 IIK Control input clamp current VIN < 0 –50 mA II/OK I/O port clamp current VI/O < 0 –50 mA II/O ON-state switch current(5) ±64 mA Continuous current through VCC or GND ±100 mA Tstg Storage temperature range –65 150 °C (1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltages are with respect to ground, unless otherwise specified. (3) The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. (4) VI and VO are used to denote specific conditions for VI/O. (5) II and IO are used to denote specific conditions for II/O. TYP UNIT θJA Package thermal impedance(1) RSE package 253 °C/W (1) The package thermal impedance is calculated in accordance with JESD 51-7. 2 Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): TS3USB31 |
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同様の説明 - TS3USB31RSERG4 |
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