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HLMP-CY12-WZ0DD データシート(PDF) 7 Page - AVAGO TECHNOLOGIES LIMITED |
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HLMP-CY12-WZ0DD データシート(HTML) 7 Page - AVAGO TECHNOLOGIES LIMITED |
7 / 9 page 7 Avago Technologies LED configuration Precautions: Lead Forming: • TheleadsofanLEDlampmaybeperformedorcutto lengthpriortoinsertionandsolderingonPCboard. • Ifleadformingisrequiredbeforesoldering,caremust betakentoavoidanyexcessivemechanicalstressthat induced into the LED package. Otherwise, cut the leads to applicable length after soldering process at roomtemperature.Thesolderjointformedwillabsorb the mechanical stress, due to the lead cutting, from travelingtotheLEDchipdieattachandwirebond. • For better control, it is recommended to use proper tooltopreciselyformandcuttheleadstoapplicable lengthratherthandoingitmanually. Soldering condition: • Care must be taken during PCB assembly and soldering process to prevent damage to the LED component. • Theclosestmanualsolderingdistanceofthesoldering heat source (soldering iron’s tip) to the body is 1.59mm.SolderingtheLEDcloserthan1.59mmmight damagetheLED. • Recommendedsolderingcondition: Wave Soldering Manual Solder Dipping Pre-heat temperature 05 °C Max. - Preheat time 30 sec Max - Peak temperature 50 °C Max. 60 °C Max. Dwell time 3 sec Max. 5 sec Max • Wave soldering parameter must be set and maintain according to the recommended temperature and dwelltime.Customerisadvisedtodailycheckonthe soldering profile to ensure that the soldering profile is always conforming to recommended soldering condition. Note: 1. PCB with different size and design (component density) will have different heat mass (heat capacity). This might cause a changeintemperatureexperiencedbytheboardifsamewave solderingsettingisused.So,itisrecommendedtore-calibrate thesolderingprofileagainbeforeloadinganewtypeofPCB. 2. Avago Technologies’ high brightness LED are using high efficiency LED die with single wire bond as shown below. Customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature is not exceeding 250°C. Over-stressing the LED during soldering process might cause premature failure to the LED due to delamination. 1.59mm Note:ElectricalconnectionbetweenbottomsurfaceofLEDdieand theleadframematerialthroughconductivepasteofsolder. • If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during solderingprocess. • Atelevatedtemperature,theLEDismoresusceptible to mechanical stress.Therefore, PCB must allowed to cool down to room temperature prior to handling, whichincludesremovalofjigs,fixturesorpallet. • Specialattentionmustbegiventoboardfabrication, solder masking, surface platting and lead holes size andcomponentorientationtoassurethesolderability. • RecommendedPCboardplatedthroughholessizefor LEDcomponentleads. LED component lead size Diagonal Plated through hole diameter 0.457 x 0.457 mm (0.08 x 0.08 inch) 0.646 mm (0.05 inch) 0.976 to .078 mm (0.038 to 0.04 inch) 0.508 x 0.508 mm (0.00 x 0.00 inch) 0.78 mm (0.08 inch) .049 to .50 mm (0.04 to 0.045 inch) • Under sizing of plated through hole can lead to twisting or improper LED placement during auto insertion.Oversizingplatedthroughholecanleadto mechanicalstressontheepoxylensduringclinching. Note: Refer to application note AN1027 for more information on solderingLEDcomponents. InGaN Device Anode |
同様の部品番号 - HLMP-CY12-WZ0DD |
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同様の説明 - HLMP-CY12-WZ0DD |
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