HLMP-CY12-WZ0DD datasheet(7/9 Pages) AVAGO

部品番号	HLMP-CY12-WZ0DD

部品情報	Precision Optical Performance 5mm Round Warm White LED Lamps

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メーカー	AVAGO [AVAGO TECHNOLOGIES LIMITED]

ホームページ	http://www.avagotech.com

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7

Avago Technologies LED configuration

Precautions:

Lead Forming:

• TheleadsofanLEDlampmaybeperformedorcutto

lengthpriortoinsertionandsolderingonPCboard.

• Ifleadformingisrequiredbeforesoldering,caremust

betakentoavoidanyexcessivemechanicalstressthat

induced into the LED package. Otherwise, cut the

leads to applicable length after soldering process at

roomtemperature.Thesolderjointformedwillabsorb

the mechanical stress, due to the lead cutting, from

travelingtotheLEDchipdieattachandwirebond.

• For better control, it is recommended to use proper

tooltopreciselyformandcuttheleadstoapplicable

lengthratherthandoingitmanually.

Soldering condition:

• Care must be taken during PCB assembly and

soldering process to prevent damage to the LED

component.

• Theclosestmanualsolderingdistanceofthesoldering

heat source (soldering iron’s tip) to the body is

1.59mm.SolderingtheLEDcloserthan1.59mmmight

damagetheLED.

• Recommendedsolderingcondition:

Wave Soldering

Manual Solder

Dipping

Pre-heat temperature

05 °C Max.

-

Preheat time

30 sec Max

-

Peak temperature

50 °C Max.

60 °C Max.

Dwell time

3 sec Max.

5 sec Max

• Wave soldering parameter must be set and maintain

according to the recommended temperature and

dwelltime.Customerisadvisedtodailycheckonthe

soldering profile to ensure that the soldering profile

is always conforming to recommended soldering

condition.

Note:

1. PCB with different size and design (component density) will

have different heat mass (heat capacity). This might cause a

changeintemperatureexperiencedbytheboardifsamewave

solderingsettingisused.So,itisrecommendedtore-calibrate

thesolderingprofileagainbeforeloadinganewtypeofPCB.

2. Avago Technologies’ high brightness LED are using high

efficiency LED die with single wire bond as shown below.

Customer is advised to take extra precaution during wave

soldering to ensure that the maximum wave temperature is

not exceeding 250°C. Over-stressing the LED during soldering

process might cause premature failure to the LED due to

delamination.

1.59mm

Note:ElectricalconnectionbetweenbottomsurfaceofLEDdieand

theleadframematerialthroughconductivepasteofsolder.

• If necessary, use fixture to hold the LED component

in proper orientation with respect to the PCB during

solderingprocess.

• Atelevatedtemperature,theLEDismoresusceptible

to mechanical stress.Therefore, PCB must allowed to

cool down to room temperature prior to handling,

whichincludesremovalofjigs,fixturesorpallet.

• Specialattentionmustbegiventoboardfabrication,

solder masking, surface platting and lead holes size

andcomponentorientationtoassurethesolderability.

• RecommendedPCboardplatedthroughholessizefor

LEDcomponentleads.

LED component

lead size

Diagonal

Plated through

hole diameter

0.457 x 0.457 mm

(0.08 x 0.08 inch)

0.646 mm

(0.05 inch)

0.976 to .078 mm

(0.038 to 0.04 inch)

0.508 x 0.508 mm

(0.00 x 0.00 inch)

0.78 mm

(0.08 inch)

.049 to .50 mm

(0.04 to 0.045 inch)

• Under sizing of plated through hole can lead to

twisting or improper LED placement during auto

insertion.Oversizingplatedthroughholecanleadto

mechanicalstressontheepoxylensduringclinching.

Note: Refer to application note AN1027 for more information on

solderingLEDcomponents.

InGaN Device

Anode

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