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74AUP1G125GW データシート(PDF) 2 Page - NXP Semiconductors |
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74AUP1G125GW データシート(HTML) 2 Page - NXP Semiconductors |
2 / 21 page 74AUP1G125_2 © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Product data sheet Rev. 02 — 30 June 2006 2 of 21 Philips Semiconductors 74AUP1G125 Low-power buffer/line driver; 3-state 3. Ordering information 4. Marking 5. Functional diagram Table 1: Ordering information Type number Package Temperature range Name Description Version 74AUP1G125GW −40 °C to +125 °C TSSOP5 plastic thin shrink small outline package; 5 leads; body width 1.25 mm SOT353-1 74AUP1G125GM −40 °C to +125 °C XSON6 plastic extremely thin small outline package; no leads; 6 terminals; body 1 × 1.45 × 0.5 mm SOT886 74AUP1G125GF −40 °C to +125 °C XSON6 plastic extremely thin small outline package; no leads; 6 terminals; body 1 × 1 × 0.5 mm SOT891 Table 2: Marking Type number Marking code 74AUP1G125GW pM 74AUP1G125GM pM 74AUP1G125GF pM Fig 1. Logic symbol Fig 2. IEC logic symbol Fig 3. Logic diagram mna118 AY 2 1 4 OE mna119 1 4 2 EN 001aad068 A OE Y |
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