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LC25WC153CGJ59 データシート(Datasheet) 1 Page - Bookham, Inc.

部品番号. LC25WC153CGJ59
部品情報  2.5 Gb/s CWDM Buried Het Laser 80Km reach
ダウンロード  5 Pages
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メーカー  BOOKHAM [Bookham, Inc.]
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Data Sheet
1
This laser module provides a fast route to CWDM by providing
a drop in replacement on existing TDM or WDM circuit packs
with minimum redesign and verification work. The product
employs the Bookham strained layer MQW Buried
Heterostructure DFB laser chip, and has been designed
specifically for use in Coarse Wavelength Division Multiplexed
(CWDM) 2.5 Gb/s optical fibre trunk systems. The device is
packaged in a hermetic 14-pin butterfly package incorporating
an isolator and monitor photodiode for control of the power of
the laser over life and all operating conditions.
The device is available with a number of power options
depending on application and link span requirements.
Features:
• Drop in replacement onto TDM and WDM card
• 2.5 Gb/s operation
• Up to 10mW optical output power available
• Narrow spectral line-width
• Internal TEC with precision NTC thermistor for
temperature control
• 1470nm to 1610nm at 20nm compliant to
ITU G.694.2
• Code reduction with single product for reaches
up to 80km
• GaInAsP SLMQW DFB single frequency laser chip
• InGaAs monitor photodiode
• Hermetically sealed 14-pin butterfly package with
optical isolator
• RoHS compliant
Applications:
• CWDM metro
2.5 Gb/s CWDM Buried Het Laser 80Km reach
LC25WC




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